Interconnect News: May 2016

By News Release | May 18, 2016

For the latest interconnect news from manufacturers and suppliers, read on!



Manufacturers Interconnect News

AVX Corporation earned TTI Supplier Excellence Awards in each of the company’s three regions – Europe, Asia, and the Americas – for the second consecutive year. Bestowed by TTI, the awards recognize AVX for having successfully fulfilled several key quality performance metrics designed to elevate supplier and distributor performance and provide maximum customer satisfaction worldwide – on-time delivery, receiving quality, customer-reported quality, administrative quality, operations and business systems, and sales and management support.

The HARTING Technology Group won Hannover Messe’s coveted Hermes Award for the second time. The company was chosen over four other competitors for the HARTING MICA (Modular Industry Computing Architecture), its mini industrial computer. The family-owned company had previously picked up the prize in 2006 for an RFID solution. The HARTING MICA (Modular Industry Computing Architecture), which was developed by subsidiary HARTING IT Software Development, is an open, modular platform that functions as a core component consisting of embedded hardware and software for Industry 4.0. The jury was impressed by the concept of lightweight virtualization via LINUX containers, which the MICA achieves in a compact field device. The MICA provides existing machinery and systems with intelligence, making it possible to turn existing factories into Smart Factories.

HellermannTyton has achieved AS9100 certification. AS9100 is a widely adopted and standardized quality management system for aerospace, defense, and aviation markets. It will allow the company to consult with its end users more closely and shape product development for aviation, space, and defense based on first-hand discussions around customers’ specific requirements.

AFC Cable Systems announced the Metal-Clad Cable Barrel Pack System, ideal for contractors who need a large volume of the same cable on one project. Available in a range of cable types with steel or aluminum armor and lengths from 1,000 to 2,500 feet, Barrel Pack reduces scrap and handling compared to using individual coils in lengths that may not match the project requirement. Contractors get the right amount of cable they need for one area of the building or project and can then move the barrel easily to another area. Barrel Pack allows contractors to buy larger quantities and save any excess for use on other jobs. The easy-pull Metal-Clad Barrel Pack, a 75-gallon fiber barrel rated for 400 pounds, is equipped with a lever-locking steel band lid. Also included is a tripod/truck combination that allows contractors to move the cable easily, without having to pick up heavy coils and carry them from location to location.

Champlain Cable Corporation is awaiting Qualified Product Listing status with the US Navy for its latest secure data communication cable, developed specially for the US naval fleet – MIL-DTL 24643C Slant “77” CAT 6A. The cables have successfully passed all Navy tests required of NAVSEA’s Quality Product List. Pending final approval, Champlain Cable will be listed on the Qualified Product Listing for these cables, which allow for secure transmittal of data and communications at a stunning rate five times that of the CAT 5E cable currently used, meeting and exceeding the rigorous requirements specified in MIL-DTL24643. Additionally, they can be installed without changing existing connections or the cable envelope for a quick and effective transition.


TTI has received TE Connectivity’s highest performance award as the Global Distributor of the Year. The award was presented to the TTI executive team during the TE Global Distribution Summit meeting in Atlanta, Ga. The annual award recognizes TE’s top-performing distribution partner based on sales and customer growth, business plan performance, and TE share and engagement. TTI’s ability to exceed sales and customer growth worldwide positioned the company to be chosen by TE as its top channel distributor partner for the sixth time in seven years. TTI’s subsidiary, Mouser Electronics, won the Global High Service Distributor of the Year award for the third consecutive year.

Arrow Electronics announced that Chris Stansbury has been named senior vice president and chief financial officer, effective immediately. He will succeed Paul J. Reilly, who is retiring from Arrow effective Jan. 31, 2017. In his new role, Stansbury will report to Michael J. Long, chairman, president, and chief executive officer. He has served for more than 20 years in roles of increasing responsibility, most recently as vice president and chief accounting officer for Arrow. Previously, he held vice president of finance roles at Hewlett-Packard and PepsiCo.

For the fourth year in a row, Mouser Electronics has been honored with the esteemed NorthFace ScoreBoard Award (NFSB) from Omega Management Group Corp. in recognition of Mouser’s excellence in global customer service and support. The award acknowledges that throughout 2015, Mouser received high levels of satisfaction for consistency in exceeding customer expectations. As it did in the three previous years, Mouser was rated 4.8 on the five-point NFSB scale from customer surveys conducted across the globe in 2015. The distributor received a 99% customer satisfaction score, based on overall order experience. Omega measures customer satisfaction and loyalty levels at least four times during the year in the categories of technical support, field service, customer service, and account management.

Other News

The 62nd annual IEEE International Electron Devices Meeting (IEDM), to be held at the San Francisco Union Square Hilton hotel, December 3 – 7, has issued a call for papers in all areas of microelectronics research and development. Overall, the 2016 IEDM is seeking increased participation in the areas of power, wearables/Internet of Things (IoT), ultra-high speed, and quantum computing devices, which will be explored in depth in special focus sessions in each area. Papers in the following areas are encouraged: circuit and device interaction; characterization, reliability, and yield; compound semiconductor and high-speed devices; memory technology; modeling and simulation; nano device technology; optoelectronics, displays, and imagers; power devices; process and manufacturing technology; sensors, MEMS, and BioMEMS.

The International Electronics Manufacturing Initiative (iNEMI), is planning regional workshops in May and June to review progress on its 2017 Roadmap. Workshops, which are scheduled for North American, Europe, and Asia, provide a first look at the next edition of the roadmap, and allow the group to gather input and feedback to ensure that regional concerns and issues are included. The North America workshop will be a face-to-face meeting held in conjunction with IEEE’s Electronic Components and Technology Conference (ECTC) on May 31 in Las Vegas. The Europe and Asia workshops are scheduled as webinars on June 9 and 23, respectively. Registration is free, but participants must register in advance.

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