Updated: January 5th, 2021

In this issue’s interconnect news, we meet DesignCon’s Engineer of the Year and are introduced to a number of new products from global suppliers.

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Eric Bogatin Named DesignCon’s Engineer of the Year

DesignCon 2016, held January 19 – 21 in Santa Clara, Calif., recognized Dr. Eric Bogatin of the Teledyne LeCroy Signal Integrity Academy with its 2016 Engineer of the Year Award for his leadership, creativity, and out-of-the-box thinking. 

The DesignCon Engineer of the Year Award honors professionals in the engineering space for innovation, forward thinking, and positive contributions to the design/test of chips, boards, or systems. After peers nom