Samtec New Edge Card Socket Combines High Density with Lower Cost

By Connector Supplier | October 14, 2013

Samtec New Edge Card Socket in BEC5 Series

Samtec’s line of high-speed edge-card solutions now includes a high-density edge-card socket (BEC5C Series) featuring up to 140 total contacts on 0.50mm pitch. This micro card socket is ideal for high-speed applications requiring board space savings. The dual-beam, bi-level contact system is on a staggered 0.5 mm pitch, which reduces card mating force without reducing reliability. This vertical socket is available for both .062″ (1.60mm) and .093″ (2.36mm) card thicknesses. Standard features include a lower-cost phosphor bronze contact, weld tabs, alignment pins, and lead-free, solder-crimp terminations for easy board processing. Tin-lead solder charges, as well as alternative platings and pin counts, are also available.

Samtec offers a complete line of high-speed edge-card sockets in a variety of pitches from 0.50mm to 2mm. Orientations include vertical, right-angle, and edge-mount designs to support high-density, standard, and specific application needs.

Visit Samtec online.

Author
Recent Posts

Connector Supplier

More than 40,000 readers in the electronics world subscribe to Connector Supplier, the best source for news and expertise on connectors, cables, sensors, antennas, and other connectivity solutions. Share your questions, news, or product information with us at [email protected].

Latest posts by Connector Supplier (see all)