June 2024 New Connectivity Products
New-to-market connectivity products, including interconnects, wire, cable, and cable assemblies, sensors, antennas, materials, accessories, tools, and development kits.
June 2024 New Connectivity Products
June 2024 New Connectivity Products > Interconnects, etc.
Molex introduced its MX-DaSH family of data-signal hybrid connectors that unify power, signal, and high-speed data connectivity in a single connector system. These innovative wire-to-wire and wire-to-board connectors are designed to support the transition to zonal architecture and address the full range of emerging applications requiring reliable data transmission. These include autonomous driving modules, camera systems, GPS and infotainment devices, LiDAR, high-resolution displays, sensor-device connectivity, and more. MX-DaSH connectors are available with sealed and unsealed options to optimize next-gen automotive architectures with assorted environmental and design requirements. Versatile configurations support different power and signal terminal sizes, such as 0.50, 0.64, 1.20, 1.50, 2.80, or 4.80mm, as well as high-speed FAKRA Mini (HFM) modules for high-speed data transmission. To ensure heightened reliability, MX-DaSH wire-to-wire connectors feature industry-leading male blade stabilization and independent secondary locks for robust and reliable terminal mating. Modular sections or cartridges in the wire-to-board option support various interfaces without changing form factors or footprints.
The space-saving board-to-board connectors in Phoenix Contact’s FS 0.635 series enable mezzanine PCB arrangements with high-speed data transmission rates up to 30 Gb/s. The floating system features a tolerance compensation of up to 0.7 mm in the “x” and “y” directions, as well as 0.6 mm in the “z” direction. This flexibility within the board-to-board connection minimizes mechanical strain and provides a reliable connection. These properties are particularly important in environments with high vibration, when using several board-to-board connectors side by side, or for automatic insertion using robots. The combination of floating and high speed is unique on the market. Due to the curved contact, the floating version achieves a data transmission rate of up to 40 Gb/s, compared to the rigid version, which supports up to 30 Gb/s.
RoProxCon from Rosenberger allows data and power to be transferred efficiently in motion applications such as turntable mechanisms and robot arms. The robust connectors can withstand high shock loads and transmit 30 W of electrical power via inductive coupling. They support data transfer rates of up to 3.125 Gb/s at a carrier frequency of 60 GHz via an air interface and enable reliable transmission through a wide variety of materials. The correct interface plays a crucial role in the safe and efficient connection of devices, machines, and systems. Contactless connectivity offers the ability to transmit power and data over short distances without relying on physical connections. In environments where traditional connectivity is compromised by vibration and dust, the contactless solution proves to be extremely reliable.
TE Connectivity (TE) introduced its NanoRF 75 Ohm coax/optical hybrid modules. This solution is engineered to help meet the high-speed, high-density requirements of next-generation video capture and processing in aerospace, defense, and marine applications. The NanoRF 75 Ohm module features a 75-ohm matched impedance in both contact construction and interface, minimizing signal loss during cable transitions. This technology facilitates high-quality signaling and supports the high-speed protocols essential for rapid video processing. Additionally, the connectors feature spring-mounted backplane contacts, providing float to help ensure accurate contact alignment and reliable, low-loss signal transmission, even under extreme conditions. The NanoRF 75 Ohm module offers a first-of-its-kind blend of high-speed coaxial and fiber-optic connections for video signals up to 18 GHz, all within a small form factor compatible with existing VPX architectures. Its compliance with standards including VITA 65.0, 65.1, 67.3, and the SOSA (sensor open systems architecture) technical standard simplifies implementation and facilitates system upgrades.
I-PEX has introduced several new connectors. The ISH 18 connector is a 0.5 mm tab-width, wire-to-board connector with high resistance to heat and vibration. It has a narrower 1.8 mm pitch and a unique terminal shape that ensures low-insertion forces, even with a high-pin count of 40 pins. Multiple harnesses may be consolidated into a single harness while maintaining mating workability. Like the other products in the ISH series, the ISH 18 withstands 125 ℃ temperatures. The Vertical Type IARPB is a board-in connector that exhibits high-vibration resistance due to the bossed structure of the housing. The housing structure has excellent visibility of the terminals after mounting. The entire circumference of the terminal is tin-plated to ensure stable solder wettability. The FPC card edge connector is a one-piece connector that may be connected to a PCB by simply inserting an FPC. No soldering process is required, improving work efficiency. The AP-50 is a high-power supply board-to-board terminal that can accommodate a 50 Amp DC power supply. By improving the shape of the spring part of the existing product, the new product can handle higher operating temperatures (-40 °C to 150 °C). When multiple AP-50s are mounted on the same board, the floating performance is further improved for easier mating. As an in-vehicle component, it has a high resistance to micro-fretting corrosion and can withstand vibrations over a long period of time.
Hirose’s HR34P expands its miniature connector offering to include this version with blind mating ability. Constructed with self-aligning elements, the HR34P Series panel mount connector guides itself into the correct mating position. Commonly used for rack-to-panel connectivity in base stations, industrial machinery, medical equipment, and more, the blind mating connector is designed for applications where the electrical receptacle is recessed or hidden. The HR34P Series circular connector features a unique floating screw design that offers a degree of play to absorb misalignment when mating. A gap between the panel and the screw enables floating of ±0.5 mm in X and Y directions. The screws are pre-coated with the Nylok anti-loosening agent. This also reduces assembly time and contributes to reducing the incidence of malfunctions due to variations in the application process, such as vibration and shock impact.
The new ENNOVI-MB2B multi-row board-to-board (BTB) connector platform features a proprietary snap-in biscuit design, allowing multiple connector units to be stacked together without solder. This unique cost-effective approach enables different pin count requirements to be accommodated via the same basic interconnect platform, without any extra expense or engineering effort. The connectors feature ENNOVI´s patented 0.4 mm miniPLX press-fit terminals made from a copper alloy that exhibits very low levels of contact resistance (<1mΩ). Each pin has a 3 Amp current-carrying capability. The optional coating of these pins with the company’s patented IndiCoat plating technology mitigates tin whisker build-up, preventing the risk of short circuits and extending operational lifespan.
June 2024 New Connectivity Products > Sensors and Antennas
Newark offers a wide range of TDK products that are essential for developing safe and reliable e-bikes, including barometric pressure sensors, inertial measurement unit (imu) ultrasonic sensors, and NTC sensor assembly and systems. As micromobility takes center stage and the demand for eco-friendly transportation surges, TDK’s contribution is powering the development and production of efficient and reliable e-bikes and pedelecs.
June 2024 New Connectivity Products > Connector Materials, Accessories, Tools, and Development Kits
Indium Corporation’s newest jetting solder paste, PicoShot NC-6M, is a no-clean, halogen-free material specifically formulated to be compatible with Mycronic jetting systems. Chemically compatible with award-winning Indium12.8HF solder paste, PicoShot NC-6M is optimized for small dot jetting and long-term jetting with Type 6 solder paste. PicoShot NC-6M offers the smallest dot jetting volume among similar jetting pastes, at 1.6nL/dot, with a minimum dot size of 230 um. In addition to exceptional jetting performance, its unique oxidation barrier promotes complete powder coalescence during reflow to eliminate graping and similar reflow issues.
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