Prototyping and Development Tools Product Roundup  

This week’s Product Roundup highlights prototyping and development tools from leading connector manufacturers and suppliers.

Prototyping and Development Tools

SV Microwave’s VITA Developer Kits allow customers to quickly and easily prototype embedded system designs for VITA 67 using ruggedized cable assemblies and backplane modules in SMPM, SMPS, and NanoRF series. This all-in-one tool set supports SOSA and CMOSS architecture and is ideal for prototyping and production-level testing. Kits include a backplane, multiport module, ruggedized VITA RF cable assemblies, screws and driver tool, contact installation and removal tools, and more. With custom test cable assembly lengths available and flexible test configurations, these kits shorten your time-to-market for system designs.

Engineers developing new products at higher speeds need reassurance that the components they select work as advertised. Samtec-designed Evaluation and Development Kits simplify the interconnect design process, reducing time to market. Samtec offers the industry’s most comprehensive set of interconnect evaluation and development tools. The portfolio of solutions includes various mezzanine, backplane, and cable assembly applications, as well as optics, precision RF, and Analog Over Array™.

The EDAC Group offers extensive prototyping and development support, including 3D models, 3D printing, and in-house design assistance to accelerate project timelines. EDAC’s engineering team works closely with you to modify standard connectors or develop entirely new interconnect solutions tailored to specific application needs.

Amphenol PCD’s Rapid Part Development (RPD) process helps design and deploy production-ready parts using 3D-printing technology for the tooling cavity. RPD expedites part development at a fraction of the time and cost of standard part development cycles, providing ready to use production parts in 4-6 weeks.​​​​​​​ The 3D-printed molds work exactly like the standard steel molds they replace, and use the same manufacturing processes and equipment. Additive manufactured molds are typically ready for use in two weeks and allow for complex part features, with details as fine as .074 mm. Standard materials range from Nylon to PEEK, and parts can be used immediately, either for qualification test or straight into production for already qualified designs. When development process requires higher volumes, serial production parts are needed and parts are switched and built using steel molds to the same design and material parameters. All the change would require is an updated FAI, without the need for costly and time-consuming re-qualification. Proven examples include tie-down strips, bonded bushings, rectangular clamps, pre-mounted clamps, and lightening hole bushings.

Digi ConnectCore system-on-modules (SOMs) from Avnet are comprehensive platforms engineered to simplify the process of designing, prototyping, and deploying connected devices in diverse industries. These kits, crafted by Digi International, offer cutting-edge embedded technologies with a plethora of connectivity options. Powered by high-performance processors, they boast a versatile array of connectivity interfaces such as Ethernet, Wi-Fi, Bluetooth, cellular, and more, facilitating seamless integration with networks and protocols. Equipped with a robust software stack, including operating systems like Linux or Android, along with middleware and development tools, these kits streamline the development journey for engineers and developers. Security features are embedded into their architecture, ensuring robust protection against cyber threats and unauthorized access. With scalability, flexibility, and comprehensive support services, the Digi ConnectCore development kits empower innovators to swiftly navigate the complexities of IoT development, accelerating the realization of tailored and reliable connected solutions.

Like this article? Check out our other Product Roundup, Product News, and Connector Industry News features and our 2025 Article Archives.

Subscribe to our weekly e-newsletters, follow us on LinkedIn, Twitter, and Facebook, and check out our eBook archives for more applicable, expert-informed connectivity content.