What are Micro TCA connectors?

What are Micro TCA connectors?

The rise of mobile telecommunications and text messaging in the early 2000s created a need to upgrade from existing carrier grade computing architectures. MicroTCA connectors addressed the need for more compact systems that were less expensive, but still maintained reliability and data throughput.

Meet the Connector: MicroTCA Connectors

MicroTCA (micro telecommunications computing architecture), also called μTCA connectors, were developed to serve the growing mobile telecommunications market. In 2006, the nonprofit PCI Industrial Computer Manufacturers Group (PICMG) ratified the MicroTCA modular, open standards for building high-performance switched fabric computer systems.

By the early 2000s, the rise of mobile telecommunications and text messaging created a need to upgrade from existing carrier grade computing architectures. A consortium of about 100 companies worked together in the PICMG to develop AdvancedTCA (ATCA) in 2002. MicroTCA was developed later for smaller telecom systems at the edge of the network. It addressed the need for more compact systems that were less expensive, but still maintained reliability and data throughput.

According to DESY’s Innovation Technology Transfer department, “MicroTCA permits high-performance and reliable data processing and control operations to be carried out at large-scale scientific research facilities and in industry. In order to meet the unique requirements of the European XFEL [X-Ray Free-Electron Laser Facility], this standard has been developed further under the leadership of DESY to become MicroTCA.4.”

MicroTCA components

The MicroTCA standard encompasses a variety of components.

• Card Cage houses all the components, provides mechanical stability, and ensures sufficient cooling. The various types support different MicroTCA modules. They vary in the number of slots (between 2 and 12 typically), the backplane architecture, and the design of the airflow (cooling).
• Backplane, a printed circuit board mounted directly into the card cage, connects all the components of a MicroTCA system and provides them with power and access to data and management.
• Cooling Unit (CU) consists of an array of fans and a controller connected to the backplane and controls air flow in card cages that have airflow cooling. Usually fitted to a specific card cage, the CU can be detachable for cleaning or replacement, or it may be integrated (non-detachable).
• MicroTCA Carrier Hub (MCH) manages power distribution and cooling and provides Gigabit Ethernet and/or PCIe/Serial RapidIO switching. Some also provide clocking. The MCH is the hub of various star topologies (i.e. for Ethernet, PCIe) on the backplane and as such require dedicated slots. Some backplanes support a secondary MCH for redundancy. The MCH works with the cooling unit; it can read-out temperature sensors and fan speed, and can change fan speed via IPMI (intelligent platform management interface).
• Power Module (PM), also called power supply, converts the AC power from the power line to DC power for the +3.3 V management power (MP) and +12 V payload power (PP). The power module uses a specific connector type that can only be installed into designated slots. Those slots cannot, therefore, carry any other type of module. A secondary power module slot is sometimes added for redundancy. Power modules vary in form factor (i.e. double width, single width), input voltage (110 V, 220 V, both), and output power (i.e. 600 W, 1000 W).
• Advanced Mezzanine Card (AMC) is a family of mezzanine cards originally developed as a supplement to ATCA to customize I/O or peripheral processing functions when plugged onto an AdvancedTCA CPU. AMC is hot-pluggable/hot-swappable. The standard specifies the PCB dimensions (single or double width variants and compact, mid-size, or full height variants); and the type, location and orientation of connectors (i.e. Zone 1, 2, 3). The AMC has multiple functions, including computing, storage, graphics card, FPGA card, FMC carrier, digitizer card, and clocking and triggering.
• Rear Transition Module is connected directly to an AMC, effectively doubling the available PCB-space per slot in an MTCA.4 card cage. Its power is provided by the AMC and therefore cannot operate on its own. RTMs’ functions include RF-signal pre-/post-processing, digital signal pre-/post-processing, clock-generation/-distribution, device interfaces, date storage, and CPU (only MCH-RTM).

MicroTCA power connector from ept meets PICMG requirements and is used in power applications, image processing, medical technology, and automation technology.

MicroTCA Modules

After MicroTCA’s release for telecom, extensions to the base standard, known as MicroTCA system modules, were released for other sectors including defense, avionics, and science.

• 0 is the base specification that underlies subsequent modules. It provides the electrical, mechanical, thermal, and management specifications.
• 1 addresses ruggedized systems such as those used in outside plant telecom, industrial, and aerospace environments. Specifications include using forced air for cooling.
• 2 provides additional requirements for temperature, shock, vibration, and other environmental conditions for use in outside plant telecom, machine, and transport industry, and military airborne, shipboard, and ground mobile equipment. This module specifies the use of air- and conduction-cooled AMC-modules.
• 3 provides more stringent environmental requirements and requires the use of conduction-cooled AMC-modules.
• 4 increases PCB-space and modularity by extending the AMC with a rear transition module (RTM). These address use in large-scale scientific devices.

As defined by the PICMG MicroTCA standard, the Samtec MTCA edge card connector accepts .062” (1.60 mm) cards and supports hot-plugging and high-speed serial connections at 12.00 GHz. MTCA features 30 µ” gold on contact area and matte tin on tail. It is surface mount and meets MicroTCA specifications for embedded computing.

Design Notes

Standards: The MicroTCA standard provides a low-cost, scalable platform for small-form-factor rack systems in applications like telecom, industrial control, and defense. The base specification covers electrical, mechanical, thermal, and management. MicroTCA was updated in 2024.

Component types: Card cage, backplane, cooling unit, MicroTCA carrier hub, power module, advanced mezzanine card, and rear transition module.

Cooling: May include fans, blowers, conduction cooling, and other mechanisms.

Environmental properties: Ruggedization specifically for forced air cooling systems, shock and vibration, temperature range

Electrical properties: Voltage AC/DC; current (Amps)

Mini Pak HD Micro TCA Power Connector from TE Connectivity

Markets and Applications

Telecom, Industrial, Mil/Aero

Small telecom systems; outside plant telecom; machine and transport industry; and military airborne, shipboard, and ground mobile equipment

MicroTCA (μTCA) vertical card edge connectors from Amphenol Communications Solutions provide 170 contacts on a 0.75 mm pitch and enable Advanced MC modules to be plugged directly to a backplane. MicroTCA card edge connectors’ conventional press-fit or surface mount assembly processes and connector designs require no costly hardware, resulting in low total applied cost.

Suppliers

Hundreds of MicroTCA solutions are available from multiple companies around the world.

Amphenol Communications Solutions, ept, HARTING, Samtec Inc., TE Connectivity, Kontron, N.A.T. GmbH, Vada Tech, Yamaichi Electronics

Like this article? Check out our other Meet the Connector articles, our Medical Market Page, and our 2024 Article Archives. 

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