Sullins FMBx High-Density Card Edge Connectors

By News Release | July 14, 2014

Sullins FMBx High-Density Card Edge Connectors are now offered in low-profile, ultra-thin, and high-temperature versions.

Sullins FMBx High-Density Card Edge ConnectorsSullins Connector Solutions, Inc. expanded its portfolio of high-density 0.050″ (1.27mm) contact center card edge connectors to include the FMBx Series. The new series features high-temperature and low-profile, ultra-thin devices that accommodate boards in thicknesses of 0.031″ (0.80mm), 0.062″ (1.60mm) and 0.093″ (2.40mm). The series supports an operating temperature range of from -65°C to +200°C, while the low-profile, ultra-thin interconnects notably boast a profile of only 0.488″. Also available are 0.039″ (1.0mm) versions, which support operating temperature ranges of from -65°C to +200°C. Engineered to provide OEMs/ODMs with the utmost in design flexibility and manufacturing efficiencies, connectors are offered in an array of terminations including staggered dip-solder, right-angle, card-extender, thru-hole (PTH), and surface-mount (SMT). Mounting style choices consist of flush mounting, flush mounting with threaded inserts, no mounting ears, and metal board-lock. The new card edge connectors are available with varied head and tail length options to facilitate countless custom and standard applications. Materials are UL94V-0-rated and withstand reflow processes up to 260°C peak for 20 seconds max.

The single-level and bi-level (double-depth) card edge connectors are ideal for employment in a wide range of high-temperature, high-density medical, industrial process control, and telecommunications designs, in which the board is thinner or thicker than standard boards, as well as those in which a standard 0.062″ board is indicated. The parts accommodating 0.031″ thick boards are particularly well-suited for medical applications, while those engineered for 0.093″ boards are commonly used in multi-layered, thicker board designs. The entire interconnect series is broadly used in medical equipment, computers and peripherals, telecommunications, industrial, burn-in ovens and test equipment, aerospace and military, consumer electronics and appliances, automotive, and gaming applications.

Single-level card edge connectors feature a current rating of 1A per contact; bi-level (double depth) versions support a contact rating of 3A per contact pair, maximizing power per inch (PPI). All versions are offered with from five to 120 contact pairs, and with a choice of materials and plating options, including selective and fully plated gold. The devices optimized for 200°C high-temperature applications are provided with cantilever pins. Depending on specified materials and mating boards, the robust parts can withstand 500 to 5000 mating cycles minimum. Molded key slots, card guides, and other customizations are also offered.

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