PCI Express 7.0 Specification Released

At twice the speed of PCIe 6.0, the new specification supports AI, machine learning, data centers, and high-speed and high-performance computing across numerous application areas.

The PCI-SIG (Peripheral Component Interconnect Special Interest Group) has released the PCI Express 7.0 (PCIe 7.0) specification to members, marking a major advancement in high-speed interconnect performance. Designed to meet the increasing needs of data-intensive applications, PCIe 7.0 doubles the raw bit rate of its predecessor, PCIe 6.0, to offer an astounding 128 GT/s (gigatransfers per second) per lane, translating to a potential total bandwidth of 512 Gb/s in a 16-lane configuration.

This evolution is a critical enabler for advanced computing architectures across AI, high-performance computing (HPC), data centers, automotive platforms, and storage systems. As processors and accelerators push toward higher core counts and data throughput, PCIe 7.0 provides the necessary bandwidth to keep interconnects from becoming bottlenecks. PCI-SIG member companies involved in the standard include companies from the computer, automotive, data center, semiconductor, security, military and aerospace markets companies, as well as connector suppliers including Amphenol, JAE, JPC Connectivity, KYOCERA AVX, Molex, Phoenix Contact, Samtec, Tarng Yu Enterprises, and TE Connectivity.

“TE Connectivity is proud to support the PCIe 7.0 specification, delivering interconnect solutions to help meet the demands of next-generation data-intensive applications. With PCIe 7.0 specification’s 128 GT/s bandwidth, our connectors and cables ensure signal integrity and reliability for AI, HPC, and cloud computing workloads,” said Roy Kusuma, product manager, TE Connectivity.

One of the most significant features of PCIe 7.0 is its ability to double the data rate while maintaining power efficiency and backward compatibility. Like PCIe 6.0, PCIe 7.0 utilizes PAM4 (Pulse Amplitude Modulation with four levels) signaling, allowing it to transmit more data per clock cycle than the NRZ (Non-Return-to-Zero) method used in PCIe 5.0 and earlier. Improvements in forward error correction (FEC), equalization, and signal integrity have also been implemented to ensure reliable data transmission at ultra-high speeds.

Amphenol Communication Solutions’ PCIe Gen 7 Mini Cool Edge IO Connector is one of the first product releases to support the new standard. This connector features a 0.60 mm pitch and a slim form factor and is capable of transmitting high-speed signals of up to 128G PAM4/PCIe Gen 7. It allows for significantly longer signal path lengths while maintaining superior signal integrity performance compared to traditional PCB routing methods.

More powerful connectors

With PCIe 7.0 pushing the limits of electrical signaling, the role of high-speed interconnects becomes more vital than ever. To support 128 GT/s transmission rates, interconnects must be precision engineered with tighter tolerances, improved shielding, and advanced contact materials to reduce signal loss and minimize crosstalk. Traditional copper interconnects may face limitations at such high data rates, prompting designers to implement co-packaged optics (CPO), active copper cables (ACCs), and active optical cables (AOCs) for certain applications. Other solutions include flyover cable architectures and twinax cabling that bypass the PCB altogether, helping reduce insertion loss and maintain signal integrity.

“Applications as diverse as AI/ML, HPC/cloud, data centers, networking and storage will shatter current throughput limitations with the 128 GT/s raw bit rates made possible in the innovative PCI Express 7.0 specification,” said Keith Guetig, VP of product management, Samtec. “Samtec’s global team of technical experts help PCI-SIG member companies implement PCIe technology over copper and optics in standard and application-specific system topologies.”

At ECOC 2024, Samtec presented a proof-of-concept demonstration with a front panel high-speed cable system operating at 128 GT/s (PCIe 7.0).

Connector suppliers like Samtec, TE Connectivity, Amphenol, and Molex will release next-generation connectors that are capable of handling 112G and 224G signaling for PCIe 7.0 and beyond. PCIe 7.0 is not expected to appear in commercial products immediately, but its release sets the stage for system architects and component developers to begin designing infrastructure around this groundbreaking standard. The PCI-SIG estimates that devices implementing PCIe 7.0 will begin appearing on the market by 2027.

Additionally, PCI-SIG has announced a new optical interconnect specification revision to enable higher PCI Express technology performance. The Optical Aware Retimer Engineering Change Notice (ECN) amends the PCIe 6.4 specification and the new PCIe 7.0 specification to include a PCIe retimer-based solution, providing the first industry standardized way to implement PCIe technology over optical fiber. The Optical Retimer ECN is now available for PCI-SIG members to download in the PCIe 6.4 and 7.0 specifications here.

As AI workloads grow more complex, storage demands expand, and cloud computing becomes increasingly essential, PCIe 7.0 will help ensure that data moves swiftly and reliably across systems.

To learn more about the companies mentioned in this article, visit the Preferred Supplier pages for Amphenol Communications Solutions, JAE, JPC Connectivity, KYOCERA AVX, Molex, Phoenix Contact, Samtec Inc., Tarng Yu Enterprise, and TE Connectivity

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