data centers

Advanced Packaging and Silicon Photonics Extend Moore’s Law

Approaching the physical limits of traditional silicon chip technology, many predicted we would soon witness the death of Moore’s law. Multi-chip advanced packaging and the rise of silicon photonics offer a path to resuscitation. Not long ago, the consensus among many engineers was that the practical limits of shrinking semiconductor chip features had been reached,Read More

AI Demands a Fresh Look at System Architecture

Engineers are rethinking system architecture to accommodate increasing data rates and performance demands. Emerging technologies like co-packaged optics and OSFP-XD pluggables promise higher bandwidth and improved efficiency. Unless you have spent the last two years living in a remote cave in the Himalayas, the emergence of artificial intelligence has likely caught your attention. There isRead More

New Connectivity Solutions for the AI Data Center

Advanced connectivity solutions are emerging to support new AI data center architectures. High-speed board-to-board connectors, next-generation cables, backplanes, and near-ASIC connector-to-cable solutions operating at speeds up to 224 Gb/s-PAM4 will accelerate the future of computing. By Wai Kiong Poon, Senior Global Product Manager for Mirror Mezz, Molex Artificial intelligence (AI) and machine learning (ML) applicationsRead More

A Standardized Approach to AI Safety and Innovation 

The U.S. Commerce Department has released its strategic vision for the U.S. Artificial Intelligence Safety Institute to advance AI with safety and responsible innovation. Hardware development is an important part of the conversation.  The rapid development and integration of artificial intelligence (AI) into various aspects of society necessitate the development of standards and guidelines toRead More

Optics Outpace Copper at OFC 2024

Bob Hult shares the phenomenal advances in high-speed optical communications showcased at OFC 2024, including interconnects for 200G per lane optical transmission, liquid cooling, co-packaged optics, PAM6, and other technologies that take us far beyond the reach of copper. The 2024 Optical Networking and Communication Conference and Exposition March 24-April 3 in San Diego nearlyRead More

Maintaining Connections in Compact Board-to-Board Applications

A system cannot sustainably operate if all components are constantly at maximum stress capacity. The ticket to longevity lies in designing a component system that can tolerate electrical fluctuations as well as physical movement of the hardware. Data centers, data storage, data display on screens – managing the amount of data and the many venuesRead More

Rugged Edge Computing Solutions for Infrastructure as a Service

An alternative to traditional IT infrastructure enables organizations to access advanced computing resources in harsh environments or remote locations without investing in proprietary data centers. Interconnects in edge nodes transmit data without the data center. Infrastructure as a Service (IaaS) allows organizations to tap into scalable, high-speed networks without investing in onsite data center equipment.Read More

Open Compute Project Initiative Drives Efficiency in New Data Center Designs

The OPC has grown into a collaborative community in which interconnect suppliers work with technology innovators to drive innovation and efficiency in data center infrastructure through open-source hardware.   The Open Compute Project (OCP) is an initiative that aims to design and share open-source hardware technologies, including interconnects, to help create more efficient data centers.Read More

SC23 Supercomputer and HPC Showcase

The Denver Convention Center hosted SC23, this year’s edition of the Supercomputer conference, with the theme of i am hpc highlighting the depth and diversity of high-performance computing. The six-day event featured 90 research papers, 51 workshops, 37 tutorials, and 15 expert panels that explored the hardware, software, and emerging applications for this amazing technology.Read More

The Numbers that Define Modern Electronics

As the data humans create and consume reaches once unimaginable volumes, a new nomenclature has been created to describe it. Carl Sagan, the eminent American astronomer, planetary scientist, cosmologist, astrophysicist, science communicator, author, and professor, invited people to imagine the huge number of stars in our galaxy. His famous quote, “billions upon billions of stars,”Read More

AOC/DAC/ACC Product Roundup

This week’s Product Roundup highlights AOC/DAC/ACC assemblies from leading suppliers. AOC/DAC/ACC Avnet supplies 3M’s Twin Axial PCIe Extender Assemblies for PCIe 4.0 applications. This family of cable assemblies includes X8 and X16 connectors utilizing 3M Low Loss Twin Axial Cable 85 ohm, 31 AWG, which is ideal for PCIe applications. With their extremely tight bendRead More

Connecting to a Green Future: Connector Suppliers Embrace Sustainability

Along with meeting demands for more capabilities and greater performance, electronics manufacturers are taking steps to conserve resources, protect the environment, and care for their employees and the communities they serve. The recent TE Connectivity Industrial Technology Index, an online survey of engineers and executives, found that “executives are five times more likely than engineersRead More

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