GB03 Series Wire to Board Wafer Connectors
By Connector Supplier
|
April 01, 2026
Greenconn – GB03 Series Wire to Board Wafer Connectors – Video
The GB03 series wire-to-board wafer connector features a 1.8mm terminal pitch and a compact, space-saving design, making it ideal for applications with limited space. The terminals are equipped with a Terminal Position Assurance (TPA) mechanism, effectively preventing disengagement due to external pull forces, thus enhancing connection reliability. Additionally, the connector incorporates anti-misinsert and latch mechanisms to improve stability and prevent signal interruption caused by vibration or impact.
More than 40,000 readers in the electronics world subscribe to Connector Supplier, the best source for news and expertise on connectors, cables, sensors, antennas, and other connectivity solutions. Share your questions, news, or product information with us at [email protected].
Latest posts by Connector Supplier (see all)
- What is an FMLB Connector? - August 11, 2026
- What is a Manual Service Disconnect (MSD) Connector? - August 4, 2026
- What is a Cable Tie? - July 28, 2026
