GB03 Series Wire to Board Wafer Connectors

Greenconn – GB03 Series Wire to Board Wafer Connectors – Video

The GB03 series wire-to-board wafer connector features a 1.8mm terminal pitch and a compact, space-saving design, making it ideal for applications with limited space. The terminals are equipped with a Terminal Position Assurance (TPA) mechanism, effectively preventing disengagement due to external pull forces, thus enhancing connection reliability. Additionally, the connector incorporates anti-misinsert and latch mechanisms to improve stability and prevent signal interruption caused by vibration or impact.

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