August 2024 New Connectivity Products
New-to-market connectivity products, including interconnects, wire, cable, and cable assemblies, sensors, antennas, materials, accessories, tools, and development kits.
August 2024 New Connectivity Products
August 2024 New Connectivity Products > Interconnects, etc.
Hirose Electric’s newly developed BM54 Series board-to-board connector combines floating functionality and miniature size to meet automotive specifications. The BM54 Series takes compact design further with the world’s smallest width class for its category. The space-saving automotive connector features a 0.4 mm pitch and a stacking height of 3.0 to 4.5 mm. Ideal for PCBs with multiple connector sets, the BM54 Series connector offers a wide floating range of ±0.4 mm in XY direction. By absorbing board misalignment errors, floating simplifies assembly and improves assembly work efficiency. A two-point contact design ensures high contact reliability and rugged performance in harsh automotive conditions. The BM54 Series has a heat resistance of 125 °C, a requirement for in-vehicle and industrial equipment. The BM54 Series also supports PCI-ex Gen4 (16 Gb/s) and MIPI D-PHY Ver. 2.1, making it well suited for automotive front cameras, rear/side cameras, displays, millimeter wave radar, and LiDAR systems.
WAGO has added four new second-generation controllers to its PFC100 family. These controllers include increased memory, are programmed with CODESYS 3.5, and can be easily configured using the controller’s web-based management system. They are equipped with optimum security standards: TLS encryption, VPN capabilities, and a built-in firewall. PFC100 G2 controllers support multiple fieldbus protocols, including EtherNet/IP Adapter and Scanner, OPC UA Sever/Client, EtherCAT, MODBUS TCP/UDP, and MODBUS RTU enabling gateways between any of these interfaces. They also support MQTT protocols, helping ensure seamless connection to your SCADA and cloud service applications.
Fischer Connectors’ versatile Fischer Core Series and the rugged Fischer UltiMate Series are available with USB 3.2 Gen 2 up to 10 Gb/s to meet the growing need for high-speed data transmission in demanding environments. These two series join the portfolio of USB 3.2 connectors and cable assemblies already available in the Fischer MiniMax miniature solutions for harsh-environment applications where SWaP (size, weight, and power) is critical. With this expanded offering in three of its flagship product lines, Fischer Connectors provides design engineers with a wide variety of ruggedized, waterproof, pre-cabled connectivity solutions that combine high-speed data protocols with the signal integrity performance and ruggedness demanded by data-intensive applications and technologies in the medical, instrumentation, and defense environments. The new USB 3.2 Gen 2 connectors are available with 9 pins in Fischer Core Brass plugs of 15.5 mm diameter and in Fischer UltiMate plugs of 18.5 mm diameter. Both series offer robust features such as IP68/IP69 sealing even when unmated, hermeticity (gas and vacuum tight) with a resin-sealed contact block, extremely high and low operating temperatures, up to 10,000 mating cycles, and two locking mechanisms: push-pull and quick-release. UltiMate connectors also allow for blind mating with an extremely robust mechanical keying. Resistant to chemicals and sterilization processes, the new Fischer Core USB 3.2 Gen 2 solutions are ideal for USB3 cameras used in orthopedic surgery or endoscopic devices. They can also be used in instrumentation applications such as assembly production lines and outdoor inspections in radiation-prone or contaminated areas.
LEMO released its innovative MP (modular plastic) Series that complements the REDEL connector family. The MP series goes beyond traditional connectors by allowing customers to easily configure, design, and build their own connector with greater flexibility. The new series features a broad range of standard modules for power, signal, data, fiber optic, and fluidic connectivity that can be combined into one single hybrid connector. The REDEL MP Series also introduces high contact density modules, an innovation that allows up to 144 contacts in a compact connector by using the card edge concept. These PCB modules can be further customized with the integration of intelligence, such as an EEPROM. The flexible and interchangeable design allows the customer to transition easily to a different configuration for future product generations, without having to change the connector footprint. Additionally, full cable assembly options are also available. This innovative product supports a broad range of applications, including medical, Test & Measurement, security, industrial, and other demanding and evolving markets.
Expanded Beam Performance is now available in ODU MINI-SNAP, ODU MEDI-SNAP, and ODU-MAC connectors. The innovative Expanded Beam Performance (EBP) technology, which is already available in the AMC Series T connectors, is now also available for the MINI-SNAP Series K, MEDI-SNAP, ODU-MAC Silver-Line and ODU-MAC White-Line product lines. As a non-contact lens technology, Expanded Beam Performance products offer a game-changing interface for fiber optic systems. EBP technology achieves numerous advantages, including low attenuation, virtually no cleaning or maintenance requirements, and a long service life.
August 2024 New Connectivity Products > Wire, Cable, and Cable Assemblies
Smiths Interconnect’s innovative Mini-Lock Connector enables extremely high frequency operation at a signal of up to 110 GHz – one of the highest frequency components on the market. This leads to more reliability, faster speed, and lower downtime. The new technology has been developed to integrate into crucial applications such as satellites, space flight, radars, unmanned vehicles, military, and other applications that require reliable communications with low-to-no downtime. This is important because advances made in these areas will ultimately translate into ever faster and more reliable global connectivity for society. A key feature of the patent pending new product is an innovative robust locking mechanism that creates a more reliable connection and a better transfer of data and information download between connected applications. The new product is designed and built to operate in high stress environments, including extreme vibration and shock conditions, such as in outer space. The product is compact, lightweight, highly reliable, and can also function in extreme temperatures ranging from -65 °C to +165 °C.
L-com’s new line of USB 3.0 double-stack adapter couplers and cables and USB 2.0 double-stack adapter couplers and cables allow users to double the number of USB ports in your rack, panel, or box, but without taking up more space. They also bring faster data transmission from USB 2.0 to match cutting-edge gear. These panel-mount-capable devices allow USB cables to be efficiently passed through a rack or panel, if desired. Choose from two USB-A connector combinations – two female jacks to two male plugs, or two female to two female. The ECF-style panel mounts fit most racks and panel cutouts. The double-stack design means two sets of USB 3.0 or USB 2.0 connections are stacked vertically. This allows for a more compact and organized installation, accommodating two USB ports in the space that might typically be occupied by one. The adapter cable has a chrome-plated, shielded, and grounded ABS housing, and 30-micro-inch gold-plated contacts that ensure reliable connection even after repeated mating cycles. The adapter comes in chrome plated, shielded, or unshielded housing types. The USB cables can be installed securely by using L-com’s ECF-style flange-mount design with screw mounting to pass through panels or enclosures. Another benefit of L-com’s new double-stack adapter couplers is better cable management. They help manage cable routing and provide a fixed point for connecting USB devices, preventing the need for loose or dangling cables inside an enclosure.
August 2024 New Connectivity Products > Sensors and Antennas
Weidmuller USA’s new wireless radio line, WI-I/O-9-U3 Wireless I/O Gateway Radio Transceiver, combines multi I/O, modem and gateway functionality – as well as IoT connectivity – into a single device, providing an all-in-one solution to improve overall system performance. WI-I/O-9-U3 is scalable (allowing for simple, complex and point to multi-point network design) and flexible (native Ethernet support and comprehensive gateway capabilities for Ethernet and serial protocols, including Modbus TCP/RTU, DNP3 I/O and MQTT + Sparkplug B). It offers secure AES encryption, advanced IP filtering, multi-level authentication and comprehensive user access and change event logging. The new Weidmuller WI-I/O-9-U3 wireless transceivers support a variety of industries (water, renewables, irrigation, oil & gas environments) by easily expanding and extending secure communications.
Percept Current Sensors from Molex address the growing demand for highly accurate busbar current sensing solutions in industrial and automotive applications. Percept Current Sensors leverage Infineon’s high-precision coreless current sensors and Molex’s unique proprietary electronics packaging technology to further reduce sensor size and weight while simplifying installation and system integration significantly. The compact, coreless design and unique electronics packaging results in a solution that is 86% lighter and up to half the size of competing current sensors. This enables higher-density packaging within devices, which contributes to reductions in overall system weight while facilitating greater design flexibility. These sensors offer increased sensing opportunities in space-constrained applications as well as those sensitive to electromagnetic interference (EMI). They also provide accuracy within 2% across a wide temperature range and entire product lifespan, along with low sensitivity and offset errors. Additionally, Infineon’s differential Hall-effect sensor design suppresses noise from stray magnetic fields, which are commonly found in demanding industrial motor-drive and automotive applications.
VIAVI Solutions Inc. launched NITRO Fiber Sensing, an integrated real-time asset monitoring and analytics solution for critical infrastructure ranging from oil, gas, and water pipelines to electrical power transmission, border/perimeter security, and data center interconnects. NITRO Fiber Sensing uses remote fiber test heads (FTH), commonly known as interrogators, to monitor fiber optic cables or fiber-enabled infrastructure and measure temperature and strain along a fiber or detect acoustic vibrations. Deployed at strategic locations, including along power cables and pipelines, FTH provides valuable infrastructure health data that can be used to drive proactive maintenance and prevent downtime.
August 2024 New Connectivity Products > Connector Materials, Accessories, Tools, and Development Kits
Newark offers Murata’s latest UWB and LoRa connectivity modules for convenient wireless integration. Murata’s UWB modules provide high-accuracy location functionality with UWB tag and anchor functions in compact packages. These modules feature integrated RF front ends, simplifying the implementation process and reducing the need for extensive RF expertise. This allows developers to seamlessly incorporate advanced location capabilities into their applications. Additionally, Murata’s LoRa modules offer a compact, integrated solution with an embedded MCU. Developers have the flexibility to utilize the MCU as the host for an end node, providing customization possibilities for various projects.
Indium Corporation’s new, high-reliability Au-based precision die-attach (PDA) preforms reduce defects, control bondline thickness (BLT), and deliver high-yield performance and reliability in critical die-attach applications. Semiconductor laser die-attach applications require the highest quality, ultra-precise solder preforms to ensure accuracy and repeatability during assembly for a guaranteed, highly reliable end product. Indium Corporation’s Au-based PDA Preforms offer the new gold standard, with highly accurate thickness control, precise edge quality, optimized cleanliness, and default waffle pack method. They are available for gold-based alloys.
Polymer Resources Ltd. launched its newest product, an unfilled, impact-modified polybutylene terephthalate (PBT) grade for electrical applications. The new TP-FR-IM3 resin delivers a complete array of high-performance properties, including excellent weatherability, high chemical and impact resistance, and flame retardance for outdoor, intermittent outdoor, and indoor components such as enclosures and housings. As a PBT material, TP-FR-IM3 resin delivers high electrical resistance, high dielectric strength, and low dielectric loss. TP-FR-IM3 resin is a promising candidate for applications such as telecom enclosures; electric vehicle charging infrastructure covers; residential and commercial plugs, switches, and outdoor enclosures for sprinkler controls; and industrial electrical and cable boxes.
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