October 2013 – Samtec expanded the Razor Beam line to include a new ultra-fine-pitch, low-profile system.
Samtec LP Array Connector in Low Profile Design Samtec’s LP Array (LPAM and LPAF Series) supports high-speed applications that require reliable, high pin-count solutions in a low-profile design. This most recent addition to Samtec’s line of high-density, open pin field arrays is available in 4mm, 4.5mm, and 5mm mated heights with up to 180 totalRead More
Samtec’s Edge Rate Contact System Optimizes Signal Integrity Samtec’s Edge Rate contact system is optimized for signal integrity performance in high-speed and multi-cycle applications. This system offers many advantages over stamped contacts and is available in various interconnects and cable assemblies with a choice of pitch, orientation, and ruggedizing options. The smooth, broad, milled matingRead More
Avnet Abacus has partnered with Samtec for Quick And Easy European Access To Comprehensive Interconnect Portfolio Avnet Abacus has partnered with Samtec to offer a drop shipment service on the complete range of Samtec interconnect products, which features high-speed, micro-pitch, and rugged/power connectors used in board-to-board, cable-to-board, and panel and I/O applications. This enhanced serviceRead More
Samtec PowerStrip EXTreme Ten60Power Samtec’s line of PowerStrip interconnects now includes the EXTreme Ten60Power socket and terminal system that delivers high current power performance of up to 60A per power blade (one blade powered at 75ºC; 30ºC Temperature Rise) with a low 10mm profile design for enhanced system airflow. This system is an ideal solutionRead More
April 2, 2013 – Samtec’s micro-pitch system is ideal for high-speed performance in space-saving applications.
Samtec Offers Screw-Down Options on Tiger Eye Interconnects Samtec’s line of Tiger Eye interconnect solutions has been expanded to include screw-down options for both board-to-board and cable-to-board systems on .050” (1.27mm) and .0787” (2.00mm) pitch. These connector systems feature rugged beryllium copper contacts for high reliability and high mating cycles. Whether used in board stackingRead More
February 5, 2013—The IT5 High Speed Elevated Mezzanine connector handles 25+ Gb/s signal lines.
January 29, 2013—Polymer’s benefits to connector technology featured at DesignCon.
January 22, 2013 – Samtec’s new patent-pending FireFly Micro Flyover System is the first interconnect system that gives the designer a choice of using either micro footprint optical or copper interconnects to meet today and next-generation data rate requirements.
January 15, 2013 – Samtec’s high-speed I/O interfaces deliver rugged, durable performance.
January 8, 2013 – Samtec’s One-Piece Interfaces provide high performance with increased design flexibility ideal for almost any application.