Samtec LP Array Connector in Low Profile Design Samtec’s LP Array (LPAM and LPAF Series) supports high-speed applications that require reliable, high pin-count solutions in a low-profile design. This most recent addition to Samtec’s line of high-density, open pin field arrays is available in 4mm, 4.5mm, and 5mm mated heights with up to 180 totalRead More

Samtec’s Edge Rate Contact System Optimizes Signal Integrity Samtec’s Edge Rate contact system is optimized for signal integrity performance in high-speed and multi-cycle applications. This system offers many advantages over stamped contacts and is available in various interconnects and cable assemblies with a choice of pitch, orientation, and ruggedizing options. The smooth, broad, milled matingRead More

Avnet Abacus has partnered with Samtec for Quick And Easy European Access To Comprehensive Interconnect Portfolio Avnet Abacus has partnered with Samtec to offer a drop shipment service on the complete range of Samtec interconnect products, which features high-speed, micro-pitch, and rugged/power connectors used in board-to-board, cable-to-board, and panel and I/O applications. This enhanced serviceRead More

Samtec PowerStrip EXTreme Ten60Power Samtec’s line of PowerStrip interconnects now includes the EXTreme Ten60Power socket and terminal system that delivers high current power performance of up to 60A per power blade (one blade powered at 75ºC; 30ºC Temperature Rise) with a low 10mm profile design for enhanced system airflow. This system is an ideal solutionRead More

April 2, 2013 – Samtec’s micro-pitch system is ideal for high-speed performance in space-saving applications.

Samtec Offers Screw-Down Options on Tiger Eye Interconnects Samtec’s line of Tiger Eye interconnect solutions has been expanded to include screw-down options for both board-to-board and cable-to-board systems on .050” (1.27mm) and .0787” (2.00mm) pitch. These connector systems feature rugged beryllium copper contacts for high reliability and high mating cycles. Whether used in board stackingRead More

February 5, 2013—The IT5 High Speed Elevated Mezzanine connector handles 25+ Gb/s signal lines.

January 29, 2013—Polymer’s benefits to connector technology featured at DesignCon.

January 22, 2013 – Samtec’s new patent-pending FireFly Micro Flyover System is the first interconnect system that gives the designer a choice of using either micro footprint optical or copper interconnects to meet today and next-generation data rate requirements.

January 15, 2013 – Samtec’s high-speed I/O interfaces deliver rugged, durable performance.

January 8, 2013 – Samtec’s One-Piece Interfaces provide high performance with increased design flexibility ideal for almost any application.

July 17, 2012 Samtec recently updated its line of HDBNC high-density RF interconnects. The interconnects are made for broadcast video applications requiring high-density panel arrays that tend to result in additional strain on the interface due to ganged cabling. HDBNC connectors are based on the familiar quarter-turn BNC coupling design, but with patented advancements permittingRead More