Samtec Razor Beam LP Low-Profile System Maximizes Board Stacking Capabilities
April 2, 2013 – Samtec’s micro-pitch system is ideal for high-speed performance in space-saving applications.
April 2, 2013 – Samtec’s micro-pitch system is ideal for high-speed performance in space-saving applications.
Samtec Offers Screw-Down Options on Tiger Eye Interconnects Samtec’s line of Tiger Eye interconnect solutions has been expanded to include screw-down options for both board-to-board and cable-to-board systems on .050” (1.27mm) and .0787” (2.00mm) pitch. These connector systems feature rugged beryllium copper contacts for high reliability and high mating cycles. Whether used in board stackingRead More
February 5, 2013—The IT5 High Speed Elevated Mezzanine connector handles 25+ Gb/s signal lines.
January 29, 2013—Polymer’s benefits to connector technology featured at DesignCon.
January 22, 2013 – Samtec’s new patent-pending FireFly Micro Flyover System is the first interconnect system that gives the designer a choice of using either micro footprint optical or copper interconnects to meet today and next-generation data rate requirements.
January 15, 2013 – Samtec’s high-speed I/O interfaces deliver rugged, durable performance.
January 8, 2013 – Samtec’s One-Piece Interfaces provide high performance with increased design flexibility ideal for almost any application.
July 17, 2012 Samtec recently updated its line of HDBNC high-density RF interconnects. The interconnects are made for broadcast video applications requiring high-density panel arrays that tend to result in additional strain on the interface due to ganged cabling. HDBNC connectors are based on the familiar quarter-turn BNC coupling design, but with patented advancements permittingRead More