TE Connectivity Announces Universal Connectivity Platform
TE Connectivity Announces Universal Connectivity Platform
TE Connectivity has introduced a new addition to its diverse range of infrastructure management solutions for the data center or LAN environment. The new universal connectivity platform (UCP) is an advanced modular cabling concept designed for speed and flexibility, facilitating data center migration from 1 to 100 GbE. Supporting both copper and fiber component cabling, TE’s UCP delivers superior rack efficiency and is ideal for rapidly changing network communications infrastructure environments where space is at a premium.
The UCP concept includes a broad range of TE components including patch panels, subfloor panel and overhead panel mounts, pre-terminated links, and adaptor modules. One common patch panel is used to accommodate both copper and fiber and can be installed within or outside the 19-inch envelope. Side-mounting brackets maximize usable space along the vertical posts of the rack system, while adaptive mounting brackets can be used strategically above and below the racks.
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