The inability to supply the demand for energy needed for the exploding growth of AI is known as the Power Wall. This factor could become a significant obstacle to continuing AI advances. The relentless growth of Artificial Intelligence has been the technology topic of 2025. The inability to supply the subsequent demand for energy isRead More
The smallest satellites fit in the palm of your hand. Larger installations are critical to telecom, datacom, surveillance, and electronic warfare systems. Regardless of size, satellites must be built to withstand the harsh low temperatures of space, the heat and g-forces of launch, radiation and vacuum conditions, and protect the precise instruments inside to deliverRead More
The versatile new small form factor mezzanine standard greatly expands performance and innovation in next generation carriers. ANSI and VITA ratified the ANSI/VITA 93.0-2025 QMC standard defining a small form factor mezzanine offering increased density compared to existing XMC and FMC form factors. This has opened the door to some exciting developments in the worldRead More
A variety of new materials and designs are helping connector manufacturers meet the demand for more rugged and water-tight electronic components. Water may be the enemy of electronics, but properly sealed and protected connectors are at work in complex applications such as outdoor weather stations, naval equipment, traffic infrastructure, lighting systems, outdoor screen technologies, andRead More
Since the launch of Google Glass in 2013 and the development of augmented reality (AR), virtual reality, mixed reality, and now AI, smart glasses have been finding practical application in a wide range of areas such as healthcare, education, industrial settings, and consumer experiences. ATTEND’s Leon Hung explains the connectivity demands of this wearable technology. Since the launch of Google Glass in 2013 and the development ofRead More
As the first SerDes standard to enter mass production with a global OEM, MIPI A-PHY is securing its standing as the leading standardized SerDes technology for high-speed connectivity. MIPI A-PHY became the first SerDes (serializer-deserializer) standard in mass production with a global OEM. The high-speed automotive SerDes chipset from Velinktech, a MIPI Contributor member company,Read More
Linear optical transceivers and co-packaged optics are evolving interconnect technologies that target the spiraling increase of power consumption. Strategies like these will be key to enabling future generations of high-performance computing systems. A common mantra in the computer design community today is the urgent quest to slow the growth of power consumption. Industry pundits debateRead More
For some, the ultimate form of mobility is the robotaxi, a fully autonomous ride-on-demand vehicle that relieves passengers of the headaches of ownership. How close is this dream to reality? It has been 100 years since Francis Houdina operated his radio-controlled automobile through New York, barreling down Broadway and Fifth Streets. While the vehicle —Read More
Heat pump technology has emerged as a powerful solution in the push toward energy efficiency for a wide variety of applications. Heat pumps can be utilized in residential and industrial HVAC systems, appliances such as clothes dryers and water heaters, and even electric vehicles. Unlike conventional heating systems that generate heat through combustion or resistance,Read More
Robots offer transformative functionality to harsh environments. In situations such as the battlefield, radiation zones, and space, robots can accomplish tasks that would be dangerous or impossible for humans. Add in AI, and they become able to analyze, adapt, interact in intelligent ways. The latest development in the rapidly evolving field of automation isRead More
The PCI standard continues to evolve to meet the challenges of PCB design and offers the flexibility to play a role in future high-speed applications. By Florian Guglhör and Martin Adamczyk, ept connectors GmbH The PCI (Peripheral Component Interconnect) standard originated in the early 1990s as a bus protocol for chip-to-chip communication and the connectionRead More
Quantum engineers must consider the complex needs of today’s computing systems as well as plan for future needs as performance expectations inevitably scale up. Three areas of consideration help guide component selection. Article contributed by SV Microwave The field of quantum computing is undergoing a rapid evolution with the arrival of new material innovations, softwareRead More
