Autosplice Launches New Direct Board Interconnect Technology (DBiT) Capabilities
Autosplice Launches New Direct Board Interconnect Technology (DBiT) Capabilities
Autosplice has expanded its industry-leading Direct Board Interconnect Technology (DBiT) capabilities to encompass a widening range of application requirements.
DBiT is an innovative process of terminating lead wires or flexible circuits directly onto a PCB. The process eliminates the need for costly connectors, while producing a high quality connection. DBiT connection types include:
- Wire-to-PCB
- Component-to-PCB
- Flex Circuit-to-PCB
- Wire or component-to-flex-circuit
Direct connection of wire, component lead, or flex circuit is quickly and easily achieved with the use of a crimping system and requires no subsequent soldering steps to complete the connection. These DBiT techniques have the advantage of solderless operations that result in more reliable connections and higher sheer/pull strength than a soldered connection. Solder-free DBiT techniques also avoid any re-heating of the PCB that can damage flex circuits or temperature sensitive components.
Because automated DBiT equipment makes use of continuous-feeding of the splicing material, every interconnection can be placed precisely on the PCB without either wasted motion or incurring any material waste or scrap. Not only do they eliminate soldering hassles and risks to both personnel and materials, but DBiT connections result in production outputs that are significantly higher than hand-soldering, resistance, and ultrasonic welding processes.
DBiT addresses the continuing challenges associated with interconnecting to and from printed circuit boards. Circuit densities are constantly increasing, thus requiring better ways of getting signals off of a board or moving signals directly from one board to another. Plus, the combination of higher performance product designs and the need for reduced power consumption is demanding more reliable board-to-lead connections for cleaner power and ground. DBiT provides high-reliability interconnects while at the same time improving production yields and reducing manufacturing costs.
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