July 2026 New Connectivity Products 

New-to-market connectivity products, including interconnects, wire, cable, and cable assemblies, sensors, antennas, materials, accessories, tools, and development kits.

July 2026 New Connectivity Products 

July 2026 New Connectivity Products > Interconnects, etc.

binder’s B23 connector series combines power supply and shielded data transmission in one compact connector for industrial automation. This new generation connector enables Ethernet transmission rates of up to 100 Mb/s. As a result, the B23 creates the foundation for modern One Cable Automation concepts (power and data in one connector) and addresses key market requirements, from reduced cabling and increased data rates to the growing decentralization of industrial systems. The advantages of this technology are particularly evident in drive technology: servo motors and drive systems connected with just one cable simplify integration, and create a leaner system architecture. The B23 combines high power density with reliable data communication in a compact size. The key features include power transmission up to 28 A at up to 630 V; shielded Ethernet/EtherCAT according to Cat5, up to 100 Mb/s; bayonet quick-locking system; screw clamp termination technology for field use; and IEC 61076-2-118 standardization for manufacturer-independent compatibility.

Molex’s Multi-Channel Liquid Cooled Busbars extend liquid cooling into the power-distribution layer, supporting currents up to 15,000 Amps with a roadmap to 25,000 Amps. Unlike conventional liquid cooled designs that use a single-channel fluid path, Molex has engineered a unique multi-channel architecture that segments the coolant path into as many as seven discrete channels. This approach not only facilitates more uniform and efficient heat extractions to reduce hot spots and thermal stress, but it also improves electrical performance stability at high currents. As a result, the Molex Multi-Channel Liquid Cooled Busbars deliver a major benchmark for thermal efficiency: a 15 °C T-Rise at 15,000 Amps. According to data simulations conducted by Molex, this architecture yields up to 20% greater cooling efficiency when compared to a single-channel design. The ability to maximize heat extraction within the same mechanical footprint gives data center architects the ability to scale power without sacrificing valuable rack space. The new busbars offer configuration flexibility, enabling customers to tailor the length, depth, and fluid inlet/outlet points to accommodate tight layouts. This flexibility, combined with a standard plug-and-play interface, allows for a seamless transition to liquid cooling without requiring a redesign of the rack infrastructure. Additional new offerings from Molex include 25.0A power modules, part of AirBorn SInergy Modular High-Speed Hybrid Connectors, and  HSAutoLink G Connector System — a compact, USCAR-compatible connector that handles automotive Ethernet speeds up to 25Gb/s.

Samtec offers FTSH series highly configurable micro pitch terminal strips. FTSH is a 1.27 mm centerline terminal strip (header) available in both surface-mount and through-hole designs, and in both vertical and right-angle configurations. These high-reliability connectors are available in 2 to 50 pins per row, with selective gold/tin plating in flash or light gold. Options to improve manufacturability include locking clips, guideposts, pick-and-place pads, ejectors, and keying shrouds for mating with cable assemblies, and tape-and-reel packaging. Samtec FTSH terminal strips are commonly used as JTAG (Joint Test Action Group) connectors. JTAG is the common name for IEEE Standard 1149.1. This standard defines a specific method for testing board-level interconnects, known as Boundary Scan. JTAG connectors can be either through-hole or SMT, and either shrouded or unshrouded. FTSH terminal strips are Samtec Severe Environment Tested qualified, RoHS compliant, and are a Samtec Extended Life Product^™ (E.L.P.^™). They meet or exceed MIL-DTL-55302 testing, are available as Samtec Automotive A-Series, and are lead-free solderable. The FFSD series is a popular low-profile ribbon cable assembly that mates with the FTSH series. Also new from Samtec, the UxV/35-FleXYZ™ ESQT series that support the UXV/35™ standard for small, unmanned craft from the RMS Consortium. These durable interconnect systems are designed to stack and nest, forming a vertical 35-pin bus that adjusts to different design sizes and configurations.

Hirose Electric’s KMA01 Series is an RF coaxial connector series designed for video transmission and antenna communication in compact systems. Supporting high-frequency performance up to 6GHz, the KMA01 delivers reliable signal integrity for automotive, industrial, and embedded applications. It supports high-frequency transmission up to 6 GHz (VSWR ≤1.5) and features a low-profile design with wire-to-board and wire-to-wire options. The automotive-grade construction stands up to demanding environments. Available in straight and right-angle configurations for flexible layouts, KMA01 is ideal for ADAS and autonomous driving systems, infotainment displays, antenna modules, and communication equipment.

ept’s One27 connector family has expanded with the addition of the Float27 series floating One27 connectors. With a time-proven 1.27 mm pitch, Float27’s floating function delivers a high tolerance compensation of up to ±0.8 mm in both the X and Y axis. Float27s are ideally suited for applications that need to bridge challenging PCB spacings, while also maintaining contact through environmental exposure to extreme shock and vibration loads. Maximum robustness is ensured by the One27 family’s dual-beam spring contacting design. By intermating the Float27 female connector with ept’s extensive line of One27 male connector options, virtually any PCB spacing between 26.1 mm and 30.7 mm can be achieved. ept guarantees optimal processability for these SMT PCB connectors through a coplanarity tolerance of just 0.1 mm.

CommScope, an Amphenol company, announced the upcoming debut of its  FastSelfClean high-density fiber connectivity technology at the Computex 2026 show in Taipei, Taiwan. FastSelfClean technology enables unique fiber-optic connector designs that provide exceptionally low insertion loss due to its V-groove fiber seating, which keeps fibers aligned during connection. The technology is designed to be modular and stackable to enable different high fiber-count connector designs. As designed, FastSelfClean connector technology will enable faster deployment of scale up and scale out networks in AI data centers by facilitating the connection of an entire rack-scale system in a 1RU panel, requiring only 24 physical connections to serve 3,456 fibers. Deployment time will also be reduced thanks to the connector design’s self-cleaning capability that actively cleans fiber end-faces with each insertion, virtually eliminating routine fiber inspection and cleaning at installation, a unique benefit over ferule-based connectors. FastSelfClean technology is planned to be released in a 144-fiber connector in 2027 for worldwide distribution.

Ironwood Electronics, a HEICO company, offers the Spring Pin Socket for BGA500 with Double Latch Lid, designed to socket and test 23 x 23 mm BGA components with a 0.5 mm pitch. The socket utilizes a low inductance spring pin contact featuring 36GHz bandwidth, a cycle life of 250,000 insertions, and reliable operation in extreme thermal cycling applications (-55 °C to +150 °C).

RS supports panel-centric MRO strategies with an extensive selection of high-quality standardized, serviceable control panel components engineered, tested, and proven to reduce industrial control panel lifecycle costs without sacrificing quality or performance. RS supports sustainable MRO lifecycle savings by helping industrial customers adopt panel-centric strategies that prioritize high‑quality, standardized, serviceable control panel components proven to facilitate simple, repeatable, and proactive maintenance processes in discrete and process manufacturing, energy and utilities, and facilities and intralogistics operations.

The new ODU-MAC RAPID metal housing is a variant of the ODU-MAC RAPID using metal instead of plastic, allowing for a thinner wall for systems with limited space, particularly in the medical, industrial, and Test & Measurement sectors. Both ODU-MAC Blue-Line frames and ODU-MAC White-Line frames in size 4 can be installed. The connector is available in black or orange housing. The space-saving spindle locking and the half-shell design ensure easy assembly, component replacement, and proper cable routing. For even greater stability and durability, optional perforated metal sheets are used for strain relief. Other benefits include high contact density, a flexible adjustable cable outlet, and the flush mounting of the receptacle. The built-in ODU-MAC Blue-Line modules have high mountability and can be installed and removed without tools. In addition, the connector is available complete with cable assembly, in line with the “one-stop shop” principle, with the interface, termination technology, and cable all provided directly by ODU.

July 2026 New Connectivity Products > Wire, Cable, and Cable Assemblies

Samtec Inc. released ARJ6 cable-to-cable, high-density panel mount cable assembly, part of Samtec’s popular AcceleRate^® HP family with 112 Gb/s PAM4 performance per channel. The ARJ6 supports PCI 6.0/CXL 3.2 and 100 GbE in AI architectures and FPGA prototyping. It mounts into a panel bracket (ARJ6-PB). When paired with Samtec’s ARP6 Series, the ARJ6 cable assembly enables cable-to-cable connection at the front panel, mid-plane, or backplane, which eliminates the need to route signals through a PCB. The ARJ6-to-ARP6 cable-to-cable connection also uses direct-attach technology which removes the transition PCB inside the cable assembly housing and replaces it with high-density contacts that solder directly to the cable. Removing unnecessary PCBs at both the panel and within the connector assembly itself streamlines the signal path and improves impedance control, overall signal integrity, and density.

Amphenol RF introduced pre-configured 2.92 mm cable assemblies built on a durable 0.141-inch conformable cable. Available in a straight plug to straight plug configuration in standard lengths from six inches to one meter, these assemblies are designed for applications requiring reliable high-frequency signal transmission, mechanical stability and repeatable performance. They are ideal for military and aerospace systems, 5G wireless infrastructure, instrumentation, and other demanding RF applications. The 2.92 mm cable assembly features a precision RF interface similar to SMA, utilizing a smaller internal body diameter and air dielectric to support frequencies up to 20 GHz. Gold-plated stainless steel connectors are intermateable with SMA and 3.5 mm interfaces while maintaining excellent electrical performance. The hand formable 0.141″ conformable cable offers enhanced mechanical durability, excellent power handling, and stable signal transmission, while providing low VSWR and outstanding return and insertion loss characteristics.

With the cabling system R&Mfreenet 4.0, R&M offers a comprehensive modular system for the physical level of local data networks (LAN). Focused on the renewed and harmonized range of RJ45 connection modules, R&M is reducing the number of variants of the EL4.0 module generation to two per category. Small parts such as adapters are no longer required or are now integrated into the module – such as tension relief, color code, and protective flap. The self-explanatory Easy Lock assembly process has been compressed into a single work step. The R&Mfreenet 4.0 system includes installation and patch cords connected with corrosion-resistant, strain- and vibration-proof IDC technology. The plug contacts are coated with a layer of gold to ensure loss-free signal transmission under all conditions.

July 2026 New Connectivity Products > Sensors and Antennas

KYOCERA AVX released the new Antenna Integrator Studio designed to streamline, accelerate, and optimize the antenna selection and placement processes for RF engineers and improve product quality, performance, and go-to-market timelines for manufacturers. Simply enter the PCB size and the number of antennas needed, select the target frequency bands, choose the optimization priority — maximizing efficiency or minimizing cost, and click “Analyze” to instantly reveal the most suitable antennas in the most optimal positions for your PCB layout, along with interactive performance charts. Then analyze the results in detail — evaluating efficiency, return loss, peak gain, and radiation patterns across frequency bands — and download DXF and 3D files for seamless integration into your PCB design. The Antenna Integrator Studio also makes it easy to order samples and begin prototyping. A roughly four-minute video tutorial walks users through a workflow to further enhance ease of use. This first version includes thousands of simulations of board-mounted embedded antennas. Future versions will include additional features and antenna technologies.

July 2026 New Connectivity Products > Connector Materials

Würth Elektronik is expanding its EMC product portfolio with nanocrystalline WE-FNCS sheets. The extremely flexible and thin nanocrystalline layers, protected by a PET cover layer, are supplied in the form of adhesive tapes and strips. They attenuate electromagnetic interference signals in the frequency range from around 10 Hz to 120 MHz. The sheets can be used as a simple, cost-effective way to make housings for electronic devices EMC compliant without the need for mu-metal. WE-FNCS nanocrystalline sheets offer an effective and easy-to-use solution for suppressing electromagnetic interference (EMI) in applications that generate unwanted magnetic fields or are affected by them. They can also increase the efficiency of wireless power transfer systems by guiding the magnetic flux and reducing stray fields.

MacDermid Alpha Electronics Solutions’ ATROX CD 560-1 is a zero per- and polyfluoroalkyl substances (PFAS) alternate silver filler die attach paste designed for metal lead frame packages and high-speed automated dispensing.  ATROX CD 560-1 offers an engineered alternate silver filler approach that supports more stable cost management while delivering reliable performance and production efficiency. The paste is formulated to support high-speed, high-volume manufacturing, offering 2.5 watts per meter-kelvin (W/mK) bulk thermal conductivity and robust die attach performance across key metal lead frame surfaces, including pre-plated frames (PPF), commonly nickel-palladium-gold (NiPdAu), and copper lead frames. Consistent dispensing performance supports repeatable flow and dispense patterns, along with clean deposits across long production runs with minimal maintenance.

July 2026 New Connectivity Products > Accessories, Tools, and Development Kits

The microArch D1025 printer from Boston Micro Fabrication (BMF) features the company’s groundbreaking dual-resolution optical system. The patented system enables fast, high-resolution 3D printing across larger build areas by integrating multiple projection lenses with distinct imaging ratios — for example, 10-micron and 25-micron resolutions — within a single optical path. This dual-lens design allows the printer to dynamically switch between resolutions on demand, optimizing detail and throughput without compromising precision. The innovation represents a significant advancement in Projection Micro Stereolithography (PµSL) technology, expanding the potential for micro 3D printing in industries such as medical devices, electronics, photonics, microfluidics, and research. By automatically allocating fine 10-micron exposures for critical features and 25-micron exposures for larger areas, the technology enables faster builds and consistent micron-level accuracy across complex geometries.

Schaltbau’s C330 megawatt charging contactor supports the current and future power class of MCS high-power DC charging. The Eddicy C330 is a single-pole, bi-directional DC contactor and the industry’s first rated for up to 1,500 V and continuous currents of up to 3,000 A. Featuring silver contact pills and an innovative contact system, the C330 achieves an industry-leading contact resistance of just 40 µOhm. This significantly reduces contact heating, power losses, and cooling requirements. With separate contact systems for switching and current carrying, the C330 protects the main current path from the negative effects of electrical arcing, delivering outstanding safety, endurance, and longevity. C330 features an open-air-isolation concept with permanent magnetic arc blow-out that prevents rupture even under the most severe failure conditions. It can withstand short-circuit currents of up to 30,000 A for 5 ms without rupturing or damaging surrounding components. The Eddicy C330 is designed for use in charging stations, energy storage systems, and photovoltaic applications. CE, CCC, and UL certifications are expected by September 2026.

Mouser Electronics is an authorized global distributor of the newest products from Altera. The Agilex 3 FPGAs and System-on-Chip (SoCs) offer high performance in a power- and cost-efficient design, featuring the Hyperflex FPGA architecture and advanced transceiver technology. The Agilex 5 FPGAs and SoCs also feature AI tensor blocks infused throughout the FPGA fabric, delivering high-efficiency AI and DSP functionality. An asymmetric applications processor system, consisting of dual Arm Cortex-A76 cores and dual Cortex-A55 cores, enables performance and power-efficiency optimization for complex workloads. The Agilex 5 FPGA E-Series 065B Modular development kit, available to order, is a complete prototyping and reference platform design environment powered by a power-optimized E-Series Agilex 5 FPGA. The development kit’s modular board and carrier architecture delivers extensive connectivity, including PCIe Gen4, SFP+ (10G), HDMI 2.0, DisplayPort 2.0, and dual 2.5G TSN Ethernet. The Agilex 5 FPGA E-Series 065B Premium development kit, also based on an E-Series Agilex 5 FPGA, integrates a wide array of connectivity options, including dual QSFP/SFP28 ports, PCIe Gen4 via FMC+, USB 3.1, and multiple Ethernet interfaces. The development kit supports three memory types (DDR4 for both the FPGA and the Hard Processor System (HPS), and LPDDR4 for high-speed data processing).

Vitrek’s advanced cable testing solution combines the power of the Vitrek V10X Hipot Tester with the scalability of the Vitrek 964i High Voltage Switching System to help manufacturers automate high-voltage cable validation, improve throughput, and strengthen quality assurance. As cable assemblies become more complex across EV platforms, aerospace systems, medical devices, industrial automation, and defense electronics, manufacturers need faster ways to validate insulation integrity, dielectric withstand performance, continuity, and wiring accuracy without increasing operator burden. The combined V10X + 964i platform transforms traditional point-by-point cable testing into an intelligent automated workflow. Key capabilities include automated routing across multi-conductor cable assemblies; high-voltage AC/DC hipot testing and leakage current detection with high sensitivity; reduced manual fixturing, setup time and barcode-enabled operator workflows; built-in PDF/CSV reporting for digital traceability; and scalable architecture for complex harnesses and production growth. The V10X delivers up to 30 kV AC output with modern touchscreen control, automation interfaces, and integrated reporting, while the 964i expands testing across multiple conductors and test points through configurable high-voltage switching cards.

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