High-Speed Mezzanine & Stacking Connectors Product Roundup
This week’s Product Roundup highlights high-speed mezzanine and stacking connectors from leading suppliers.
High-Speed Mezzanine and Stacking Connectors
The MA01 Series from JAE floating-board connectors feature a highly reliable two-point contact structure, achieving high-speed transmission that exceeds 8 Gb/s. With an operation temperature range of -40 ℃ to 125 ℃ the connector is suitable for the harsh temperature environments unique to the automotive industry. The MA01 Series solves many of the issues found in today’s automotive ECU applications, such as misalignment during assembly, design limitations, and spacing constraints. These connectors also work well for factory automation equipment, semiconductor manufacturing equipment, office machines, communication equipment, measuring equipment, and broadcasting equipment.
TE Connectivity’s flexible stacking connectors deliver design flexibility and productivity for manufacturers. The portfolio of free height, fine stack, and fine mate connectors is suitable for vertical, parallel stacking, and board-to-board mezzanine connections. Ranging from 0.5 to 0.8 mm centerline, with stacking heights from 1.5 to 6 mm, they offer a variety of centerline, stack height, and application options to meet an array of needs. Their flexibility makes these connectors ideal for industrial robotics applications, but they also are useful in personal computers, tablets, telecommunications, servers, Test & Measurement equipment, and medical equipment. TE’s latest free height (FH) stacking solutions include 16G 0.5 mm Free Height COM Connectors that connect PCBs in a parallel-stacking, mezzanine configuration with up to double the speed (16 GT/s) of many previous 0.5mm FH connectors, and 32G 0.8mm Free Height Connectors which achieve speeds of 32 Gb/s+. These high-speed, mid-density mezzanine solutions deliver an excellent price-to-performance ratio and are 56 Gb/s PAM4, and PCIe Gen 5-ready, for future system upgrades.
The IT8 mezzanine connector system from Hirose enables 56 Gb/s performance with the highest signal density in the market, featuring Quasi-Coaxial Structure and Polarity-Swap FEXT cancelling technology. The IT8 Series delivers a highly reliable and flexible solution for design of current and future high-speed systems. IT8 is available in two stacking heights: -10 to 13 mm (two-piece type) and -14 to 46 mm (three-piece type) and offers multiple mounting capability (±0.2mm floating range in X and Y directions). The BGA attachment with “Pin in Ball” ensures reliable solder joints with high SMT processing yields. IT8 has excellent reflow solderability with superior BGA coplanarity control and is compatible with double-sided and inverted reflow soldering.
Greenconn’s floating connectors are designed with spring-like terminals in the separated interior and exterior insulators that are capable of withstanding misalignment in all X, Y, and Z axes. These features also allow for a high level of shock and vibration resistance. This product has a compact design and provides high pin spacing which can be effectively used in the inter-board of a PCB. The number and spacing of pins within the connector can be selected to accommodate the design of any application. Greenconn’s floating mechanism is characterized by the absorption of alignment errors at the contact point of the receptacles. The dual contacts shift with respect to the movement of the connector, thereby achieving flexible range of motion.
The compact BergStak HS 0.8 mm board-to-board connector from Amphenol ICC is a flexible solution for high-speed applications. FCI Basics BergStak HS connector family is known for its fast data transmission, high signal quality, and proven reliability under extended periods of application. The BergStak HS 0.80 mm connector family with 0.80 mm pitch enables high-speed data applications with up to PCIe Gen 5 32 Gb/s. It offers free pin use of 5 mm stack height, meets SAS 4.0 and PCIe Gen 5 standards, and is environmentally friendly with RoHS and low-halogen compliance. These connectors can be used in data servers, medical applications, and industrial automation.
TE Connectivity (TE) introduced its Mezalok High-Speed Low-Force (HSLF) XMC connector to support data rate speeds up to 32+ Gb/s for improved signal processing on embedded computing applications. The enhanced HSLF Mezalok connector joins TE’s family of rugged, highly reliable connectors designed to meet the growing demand for higher data rates. Designed specifically for mezzanine applications, the connector meets legacy Mezalok high-speed connector qualifications and uses a rugged dual point contact system. The fast, refined, rugged, upgradeable, and flexible Mezalok HSLF XMC connectors meet the same rugged standards as VITA 47 and VITA 72. They are best suited for aerospace, ground vehicle, marine, and missile defense applications and feature a wide operating temperature range and excellent thermal stability with VITA 42.3 pinout.
Samtec Q Strip® connectors are designed for high-speed board-to-board applications where signal integrity is essential. The Q Strip connectors have surface mount signal contacts as well as a surface mount ground plane between the two rows of signals, for improved electrical performance and to reduce row-to-row crosstalk. The integral ground plane is rated to 25 A if used for power applications. The mating QTH (terminal strip), QSH (socket strip) products, on 0.50 mm pitch, are available in seven stack heights, from 5.00 – 14.00 mm. QTH/QSH is available with up to 180 pins total. Both series are available in right angle designs, making them suitable for parallel, perpendicular (90°), and coplanar (or horizontal) board-to-board designs. QTH/QSH is also available in differential pair configurations. Other Q-Strip products include the 0.80 mm pitch QTE/QSE products, 0.635 mm pitch QTS/QSS series, as well as Q2™ rugged versions (QMT, QMS series). Mating high-speed cable assemblies are also available. Most Q Strip mated sets are stack-height compatible with Samtec’s mPOWER™ micro-power connectors, which provides signal and power connector sets on the same stack height.
Cinch Connectivity Solutions’ CIN::APSE solderless, high density, custom interconnects are used for board-to-board, IC-to-board, flex-to-board, and component-to-board applications. CIN::APSE is the most widely implemented crimpless and solderless, high speed, interconnect in the industry. The simple two-piece design enables 50+ Gb/s, and a wide range of profiles from 0.020” to 1.0”. CIN::APSE contacts are available in 0.5 mm and 1.0 mm diameters with a standard pitch of 1.0 mm or greater. There is no limit to the number of contacts; the largest connector implemented to date contained 7,396 I/Os. Solderless termination is achieved through compression and the unique contact design assures multiple points of contact per I/O. The CIN::APSE interconnects have proven reliability under the most extreme mechanical shock and vibration.
HyperStac RX Series from Smiths Interconnect is a Z–axis interconnect designed for all types of microelectronics requiring reliable and compact packaging solutions: interconnection of MCMs (MultiChip Module) to PCBs, MCM to MCM, and PCB stacking. The Hyperstac RX Series meets the needs of applications in the Defense (missile computers, fighter aircrafts, UAVs), Avionics (radars and digital control boxes), and Space (launchers, satellites, space vehicles) markets. The HyperStac connector can be configured to numerous footprint options, including MCM, square, and rectangular, and is also available in strips of different sizes (30 contacts or more). The connector is fully ESA–qualified.
The 8152 series from KYOCERA AVX is a 0.4 mm pitch board-to-board connector with an XY floating. It conforms to high-speed transmission standard MIPI D-PHY (2.5 Gb/s), PCI Express Gen2 (5 Gb/s) and Gen3 (8 Gb/s). The frame is shielded for a robust design and EMI reduction suitable for demanding automotive applications
Check out related Product Roundups: board-to-board connectors and mezzanine products.
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