March 5, 2013–The new 1681 series has an IEC-style C22 appliance inlet for hot conditions up to 155°C.

March 5, 2013 – Versatile power entry module now offered with custom wires.

March 5, 2013—USB and RJ45 communication interface ports join the Platinum Series family.

March 5, 2013–Oval Contact System (OCS) features improved signal integrity, increased data rates, and a smaller form factor as compared to industry standard quadrax.

March 5, 2013 – Integrated drop-in solution simplifies implementation of Power-over-Ethernet.

March 5, 2013 – Non-magnetic combination D-subminiature connectors ideal for medical imaging equipment.

March 5, 2013 – With the highest voltage rating for both UL and IEC, it is ideal for worldwide use.

January 22, 2013–New IEC 60320-style C22 inlet with power line filter fills market gap.

February 19, 2013 – Hirose’s DF60 Series connector has multiple mis-mating preventive features.

February 19, 2013 – The environmentally sealed connector is now certified to the European standard for use in photovoltaic systems. 

Molex SpeedStack Delivers High-Speed Data Rates in High-Density Connector Molex introduced its SpeedStack Mezzanine Connector System, a high-density, low-profile solution that supports data rates up to 40 Gb/s per differential pair. The system is ideal for OEMs that contend with limited PCB real estate in a variety of industries, including telecommunications, networking, military, medical electronics,Read More

February 12, 2013 – FCI product family includes board connectors and cable assemblies.