The industry continues to take impressive steps forward, as evidenced by new products in the connector and cable world. DesignCon 2018 opened under sunny Bay Area skies, which seemed a perfect match for the mood among attendees. This conference featured over 100 technical sessions organized in 14 conference tracks, along with a two-day exhibition withRead More
Summary coverage of upcoming events and recent news from across the connector industry. Industry News February 2018 – Part I Event News BIRNS is showcasing its latest subsea connectivity technology at Underwater Intervention 2018, February 6–8 in New Orleans, including: new open-faced, pressure-rated coax and electro-optic-coax-mechanical hybrid options for its 6km-rated Millennium™ Series, ABS ProductRead More
This year, DesignCon promises a full array of events, including technical sessions, panels, training boot camps, and hundreds of exhibits featuring the latest connector technology. DesignCon is one of the premier conferences and exhibitions for the high-speed communications and semiconductor communities. Held each year in Santa Clara, California, this jam-packed three-day event includes continuingRead More
Summary coverage of upcoming events and recent news from across the connector industry. Event News DesignCon 2018, which will take place January 31 – February 1 in Santa Clara, California, will feature in-depth education, top-tier suppliers, and easy networking activities designed to help chip, board, and systems design engineers stay ahead of the pack, pushRead More
Summary coverage of upcoming events and recent news from across the connector industry. Industry News for December 2017 Event News DesignCon’s 2018 keynote presentations are open to all pass types and will include a panel discussion that brings some of the industry’s brightest minds together to discuss the SI/PI and EMI forecast for the nextRead More
Do you have your finger on the pulse? We do! Here’s the last few weeks of industry news in a nutshell, with links to full press releases for further information. Industry News – October 2017 Event News Molex will showcase its broad range of power, signal, data, and media connector solutions at this year’s EngineeringRead More
Circuit board modules used for watch band concept The ability to cram more powerful electronics into smaller spaces has made portable equipment a pace-setting field for the electronics industry. Smartphones have become the flag bearer for this movement, but smart watches are rapidly ramping up the competition. Early generation watches were fairly large, soRead More
Several trends were apparent at last week’s DesignCon 2017 conference. Foremost among them was the advance of copper solutions that include wiring as an alternative to PCB traces. DesignCon 2017 opened amid a thoroughly drenched Bay Area, but did not deter more than 5,000 attendees to this premier exhibition of leading edge electronic design,Read More
Technical sessions at DesignCon 2017 in Santa Clara will examine next-generation technologies for speedy, compact connectors, while booths on the show floor will give users a place to see the newest commercial implementations for a broad range of applications. The soaring demand for more data is putting pressure on connector makers who need toRead More
Interconnect News for January 2017 Events DesignCon will return to the Santa Clara Convention Center January 31 – February 2, 2017. In addition to technical paper sessions, industry panels, product demos, and exhibits from leading industry experts and solutions providers, this year’s conference will offer a range of programming dedicated to the education andRead More
DesignCon 2016 featured 33 interconnect manufacturers, all concentrating on ever-higher speeds and improved signal integrity. DesignCon 2016 opened in the shadow of preparations for Super Bowl 50 at Levi’s Stadium, directly across the street from the Santa Clara Convention Center. With more than 160 exhibitors and 4,800 pre-registered attendees, the exposition and conference continuesRead More
The DesignCon community honored Dr. Eric Bogatin with the prestigious Engineer of the Year Award for his many contributions to the engineering industry. DesignCon 2016, held January 19 – 21 in Santa Clara, Calif., recognized Dr. Eric Bogatin of the Teledyne LeCroy Signal Integrity Academy with its 2016 Engineer of the Year Award forRead More
