Advanced connectivity solutions are emerging to support new AI data center architectures. High-speed board-to-board connectors, next-generation cables, backplanes, and near-ASIC connector-to-cable solutions operating at speeds up to 224 Gb/s-PAM4 will accelerate the future of computing. By Wai Kiong Poon, Senior Global Product Manager for Mirror Mezz, Molex Artificial intelligence (AI) and machine learning (ML) applications … Continue reading New Connectivity Solutions for the AI Data Center