July 2013 – New connectors provide functional reliability even at high temperatures and when using high-pressure cleaners.

July 2013 – Yamaichi offers components for all five versions on both the board and cable sides.

Samtec LP Array Connector in Low Profile Design Samtec’s LP Array (LPAM and LPAF Series) supports high-speed applications that require reliable, high pin-count solutions in a low-profile design. This most recent addition to Samtec’s line of high-density, open pin field arrays is available in 4mm, 4.5mm, and 5mm mated heights with up to 180 totalRead More

July 2013 – The 28-circuit, high-current, right-angle compact header meets challenging space requirements in IP6K7- and IP6K9K-sealed transportation applications.

July 2013 – C&K rugged smart card connectors offer higher contact forces for harsh environment applications.

Built on a legacy of customer success, Molex commemorates its proud past and looks to a powerful future.

TE Connectivity Showcases Latest Rugged, High-Speed Interconnectivity Solutions TE Connectivity (TE), along with newly acquired DEUTSCH, featured the latest ruggedized, next-generation, high-speed connectivity solutions at the 2013 Paris Air Show last month in Paris, France. Featured sytems and solutions included: Solutions for avionics – Advanced fiber optic, high-speed copper systems, and the next generation ofRead More

NWI Lab360 Endurance Test Exceeds Life Cycle Expectations Northwire Inc. (NWI) certified project managers reported extreme temperature conditions ranging from -65°F to 300°F during endurance trials. Tests conducted on high-flex retractile cables to predict life expectancy achieved 400,000 cycles. Inside Northwire’s on-site test and development facility, the cable manufacturer rapidly responds to meet customers’ demandsRead More

July 16, 2013—Souriau already switched 20% of its cadmium plating to zinc nickel.

Advanced Interconnections Corp. has completed the International Traffic in Arms Regulations (ITAR) registration process with the US Department of State, Directorate of Defense Trade Controls (DDTC).

July 11, 2013—The portfolio of ERNI PowerElements now includes versions with purely massive press-fit contacts.

Molex RF DIN 1.0/2.3 Modular Backplane System is a Subminiature Solution Molex announced a high-performance connector system designed specifically to enable PCB developers in the video, commercial broadcast, and telecommunications industries to transfer multiple RF signals across mated boards in a single assembly while taking into consideration space constraints. The RF DIN 1.0/2.3 Modular BackplaneRead More