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Samtec Debuts HDBNC High Density RF Connectors

July 17, 2012 Samtec recently updated its line of HDBNC high-density RF interconnects. The interconnects are made for broadcast video applications requiring high-density panel arrays that tend to result in additional strain on the interface due to ganged cabling. HDBNC connectors are based on the familiar quarter-turn BNC coupling design, but with patented advancements permittingRead More

IPC Discusses Regulations With Federal Committees

At the invitation of U.S. House Oversight and Government Reform Committee Chairman Darrell Issa (R-CA), IPC President Dr. John W. Mitchell outlined existing and proposed regulations that negatively impact the electronics manufacturing industry. In a letter to Issa, IPC identified four issues that the company said burden the industry, further contributing to the continued declineRead More

New Hirose VIP Partnership Makes DF36 Series Easier to Design In

Hirose has partnered with Micro Interconnects to help design engineers specify and design in DF36 board-to-fine coaxial cable connectors. The 0.4mm pitch, 1.5mm mated height board-to-fine coaxial cable connector for displays, instrumentation, and high-definition imaging applications offers high contact reliability and enhanced shielding, making it ideal for applications in space-restricted areas, such as hand-held devices.Read More

2026 World Connector Market Handbook 2025-2031F
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