High-Speed Copper Assemblies Product Roundup  

This week’s Product Roundup highlights high-speed copper assemblies from leading connector manufacturers and suppliers.

High-speed Copper Assemblies

I-PEX CABLINE Series connectors enable high-performance harness assemblies by combining high-density packaging, high data-rate capability, excellent signal integrity, multiple pin-count options, and compact form factors for demanding high-speed applications. Selecting the optimal CABLINE harness requires balancing electrical parameters including impedance, insertion loss, cable length/AWG, frequency, pin assignment, and EMI shielding with mechanical requirements such as connector pitch/height, orientation, retention, strain relief, mating cycles, routing, and minimum bend radius. Micro-coaxial, twinaxial, discrete, and mixed harness configurations provide additional design flexibility. Various cable outer-jacket materials and constructions can support applications requiring sharp bends, tight flex radii, and space-constrained routing. For design validation, I-PEX SI test boards enable high-accuracy measurement of critical parameters including insertion loss, return loss, VSWR, and crosstalk, helping engineers verify high-speed performance before final implementation.

Si-Fly® HD co-packaged and near-chip systems provide the highest density 224 Gb/s PAM4 solution in today’s market. The SFCM mounts directly to the package substrate and is pluggable with Samtec’s SFCC cable assembly or an optical module of your choosing. CPX offers electrically pluggable co-packaged copper (CPC) and co-packaged optic (CPO) high-density, high-performance interconnects on a 95 mm x 95 mm or smaller substrate. The Si-Fly HD solution provides the lowest loss signal transmission from the package to the front panel or backplane while providing the highest density (use copper for short distances/scale up, optics for extended reach/scale out). This versatile product family is the foundation of the OPEN CPX MSA mechanical interface.

Phoenix Contact’s FINEPITCH FR 1.27 cable assembly solutions provide a reliable platform for high-speed copper data transmission in applications where signal integrity, compact design, and flexible system integration are critical. Combining a 1.27 mm pitch connector system with preassembled cable options, the FR 1.27 portfolio enables fast, error-free device connections while supporting the high data rates required in Industrial Automation, Test & Measurement, Transportation, and Communication systems.

A versatile, two-piece connector system, Molex’s Impress Co-Packaged Copper Solutions deliver near-ASIC, on-substrate connectivity designed to support 224 Gb/s PAM‑4 and beyond for next-generation AI and hyperscale data centers. The high-density Impress system uses 30 AWG twinax wires to deliver exceptional signal integrity, scalable density, efficient power delivery, and robust durability in a compact form factor.

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