BH Tech Trends Series

Signal Integrity: More Important than Ever

The process of ensuring signal integrity is not a precise science. Even the tiniest nuance anywhere along a channel can cause reflections, crosstalk, or prohibited levels of emitted radiation. A long time ago in a galaxy far, far away, designers of high-speed digital circuits could quickly verify performance by building a physical “breadboard” prototype. EngineersRead More

OSFP-XD Pluggable Connectors are Finding a Home

OSFP-XD pluggables are targeting AI applications in data centers, high-performance computing (HPC), and select telecom networks. Connectors designed to transfer information in and out of a server, switch, or router have long been recognized as a potential data bottleneck. Processing chips often spend half their time waiting to receive information necessary to function, resulting inRead More

OFC 2025 Looks to the Future with Optical Breakthroughs 

From data center interconnects and energy-efficient optical networks, this year’s show highlighted advances in coherent transmission systems, photonic integration for AI applications, and intelligent network automation that will reshape global connectivity. The 50th anniversary edition of the Optical Fiber Communication Conference and Exhibition reflected the enormous growth and enthusiasm for the future of optical networkingRead More

Humanoid Robots Reporting for Work

Humanoid robots are a subset of general-purpose robots that include large and small robotic arms that have become an essential enabler of factory automation. The development of humanoids that utilize artificial intelligence is now in the process of blurring the line between man and machine. People have been fascinated for hundreds of years with theRead More

30 Years of DesignCon

The interconnect industry’s biggest gathering celebrated its 30th anniversary this year. Technologist Bob Hult has attended every one of them. Here’s what captured his attention this year. DesignCon 2025 marked the 30th anniversary of this premier technical conference for designers of high-performance chips and printed circuit board systems. An increasing number of attendees are drawnRead More

Open Standards Provide a Path to Innovation

Standards related to electronic devices guarantee interoperability and expands market opportunity for high-volume production that reduces cost and encourages collaboration as well as competition to develop the most effective solution. A universe of standards plays a critical role in the complex world we live in. Imagine having different plugs on your toaster and coffee maker,Read More

AI-Enabled Traffic Control, where are you? 

It seems like the effects of climate change are appearing everywhere. Record levels of moisture, drought, and temperature extremes are being recorded nearly every day. Even skeptics are beginning to accept that our climate is changing in detrimental ways. The only issue remaining is if it is a result of a natural cycle or dueRead More

Heat in Data Centers: The Conundrum of Thermal Management 

Heat has a direct effect on device reliability. As the internal temperature of a chip exceeds its maximum rating, reliability begins to drop off. This results in a shortened life or complete chip failure. Advancing the limits of computing performance has been a constant defining objective of system designers since the first commercial computers wereRead More

Artificial Intelligence: Impact on the Connector Industry

Computer-intensive applications have stimulated the growth of a large-scale purpose-built AI infrastructure. The connector industry will benefit from the AI evolution due to demands for exceptional speed, reduced latency, and energy efficiency. Artificial intelligence exploded into public awareness on November 30, 2022, with the release of ChatGPT and its influence has grown exponentially ever since. ThisRead More

Advanced Packaging and Silicon Photonics Extend Moore’s Law

Approaching the physical limits of traditional silicon chip technology, many predicted we would soon witness the death of Moore’s law. Multi-chip advanced packaging and the rise of silicon photonics offer a path to resuscitation. Not long ago, the consensus among many engineers was that the practical limits of shrinking semiconductor chip features had been reached,Read More

AI Demands a Fresh Look at System Architecture

Engineers are rethinking system architecture to accommodate increasing data rates and performance demands. Emerging technologies like co-packaged optics and OSFP-XD pluggables promise higher bandwidth and improved efficiency. Unless you have spent the last two years living in a remote cave in the Himalayas, the emergence of artificial intelligence has likely caught your attention. There isRead More

Optics Outpace Copper at OFC 2024

Bob Hult shares the phenomenal advances in high-speed optical communications showcased at OFC 2024, including interconnects for 200G per lane optical transmission, liquid cooling, co-packaged optics, PAM6, and other technologies that take us far beyond the reach of copper. The 2024 Optical Networking and Communication Conference and Exposition March 24-April 3 in San Diego nearlyRead More

World Connector Industry Forecast 2025-2030