HARTING har-flexicon Connectors and Terminal Blocks
HARTING har-flexicon connectors and terminal blocks deliver greater PCB performance and density with robust connectivity.
HARTING unveiled its har-flexicon series of discrete wire-to-board connectors and terminal blocks, which deliver greater PCB performance and density with robust connectivity. These miniature components offer design and manufacturing flexibility, for any termination technology, that make possible a lower all-in cost of the PCB. These har-flexicon surface-mount components for pluggable single-conductor wiring of I/O signals are available in two main pitch categories.
The traditional 3.5 mm–5.08mm sizes have standard contact spacing and screw or push-in (spring cage) wire termination and surface-mount-compatible termination to the board. The device-side connectors can be directly wired to create a horizontal or vertical terminal block with high vibration and shock resistance. If high current is required, the 5.08mm size is rated up to 17.5A for the terminal block and 15A for the two-piece connector.
The 1.27mm and 2.54mm sizes fill the evolving niche for finer pitch. The 1.27mm with IDC – a simple, fast, reliable tool-free termination for single wires – caters to the radical miniaturization of PCB termination. The 2.54mm size includes a connector and terminal blocks with two to 12 contacts and push-in termination as well as a positive latching system between male and female components. Both 1.27 and 2.54 sizes are full SMT design and include a robust hold-down to assure secure fixing to the board, a primary concern for the designer specifying SMT connectors.
The SMC (thru-hole) termination connectors come in a box with dry bag (MSL 2a) while the full SMT connectors are delivered in tape-and-reel packaging (MSL 1). For automated assembly, PCB makers can place and reflow har-flexicon device-side components along with all other board components – capacitors, resistors, integrated circuits, etc. – in a single SMT or SMD production run as opposed to separate steps using reflow and wave solder processes.