ECT to Present Breakthrough PCBA Test Probe Technologies at SMTAI 2013
ECT to Present
Everett Charles Technologies’ (ECT) announced that Brian Crisp will present at the upcoming SMTA International Exhibition at the Fort Worth Convention Center in Texas. “Probe Technologies to Improve First-Pass Yields,” will be presented during Session LF4, “Actively Improving Your Soldering Process,” on Thursday, October 17.
As test coverage for Printed Circuit Board Assemblies (PCBAs) has declined due to product miniaturization and other design constraints, manufacturers have been using via structures for test access points. Vias are not typically optimal test targets. Also, the proliferation of new PCBA material finishes, including various types of OSPs and lead-free solders, has led to flux contamination challenges and other manufacturing issues, which complicate contact reliability during test.
These two trends are driving the test probe industry to develop new technologies to improve first-pass yield and throughput, and help lower the cost of test in manufacturing. By leveraging its expertise in semiconductor probe technology, ECT has pioneered two “breakthrough” PCBA test probe technologies that significantly improve contact reliability, and increase mean-time-between-replacement (MTBR). Crisp will present the new technologies and their benefits.
Crisp is a regional sales manager with Everett Charles Technology, currently managing the Western US and Mexico. He is a leading authority on spring contact interconnects, with more than 20 years of experience related to PCB and semiconductor test and OEM product applications.
- MikroElektronika Intel Joule click shields - May 10, 2017
- Right Angle Board-to-Board Battery Connectors Suit High Shock and Vibration Applications - May 10, 2017
- Compression Pulling Head Family Offers Six Sizes - May 3, 2017