Introduced at OFC 2026, the new XPO pluggable modules provide a solution to the challenges of signal density, thermal management, field serviceability, and power efficiency. Continuing advances in artificial intelligence face multiple constraints including power consumption, access to memory, thermal management, and limitations of copper connectivity. Solving these challenges could still result in hobbled systemsRead More

Characterization and modeling of connector losses in internal connector interfaces. Article Contributed By Baptiste Bouix, Product Manager, Würth Elektronik When two or more PCBs need to be interconnected, designers must select the appropriate connectors for their application. However, choosing the wrong connector can compromise the entire design. Larger pitches like 0.8 mm and 1.0 mmRead More

An LGA (land grid array) socket is a zero-insertion-force or low-insertion-force CPU interconnect in which the electrical contacts reside in the socket on the motherboard rather than on the processor package itself. LGA sockets are the dominant CPU interface in desktop, server, and workstation platforms. The socket format allows OEMs to design boards for multipleRead More

Two interconnect companies combine their expertise to address the unique connectivity challenges of rapidly expanding AI infrastructure. AI’s computational needs are growing more than twice as fast as Moore’s Law, pushing toward 100 gigawatts of new demand in the U.S. by 2030. Long-time partners Anderson Power and JPCPT, the U.S.-based division of JPC Connectivity (JPC), haveRead More

Data center growth is reshaping how infrastructure is designed and scaled, placing new demands on the connectors that underpin power and data transmission. By Greg MacDonald, global business development manager – Amphenol CS Products, PEI Genesis Data centers are foundational to the global digital economy, supporting everything from cloud services and financial systems to AI, healthcare,Read More

It’s all about high speeds but some customers will take a little longer to get there. The world is increasingly looking to AI solutions, creating a growing demand for speed and scale. To keep pace with this new era in technology, the Ethernet Alliance released its 2026 Ethernet Roadmap. This detailed outline highlights the technologies,Read More

What are EDSFF Connectors? EDSFF connectors are a family of form factors used by Enterprise and Datacenter SSD Form Factor (EDSFF) drives. This high-speed, high-power, enterprise-grade PCIe/NVMe SSD connector standard was developed by the SNIA (Storage Networking Industry Association) to meet the needs of modern data center design with scalability, density, and thermal performance. This interface is optimized forRead More

Advanced signal conditioning and error correction have contributed to achieving channel bandwidth far beyond what was expected just a few years ago. Moving to a higher order modulation provides a pathway to achieving next generation speeds. Constantly increasing data transmission speed over a communication link has been a key enabler of achieving higher computing performanceRead More

Data centers use many methods to keep their information and communication technology equipment cool, including traditional air-cooling and newer immersion cooling methods. Article Contributed By David Beach, Market Segment Manager, Anderson Power Air-based cooling systems have been the go-to method for keeping information and communication technology (ICT) equipment cool. Often configured with hot/cold aisles forRead More

Meet the Connector: Hard Metric Connectors Hard metric connectors are a highly standardized, high-density solution for high-speed data and power transmission. The term “hard metric” refers to the exclusive use of standard metric measurements, as opposed to “soft metric” components that use metric dimensions converted from inch measurements. The highly standardized hard metric connectors areRead More

AI leadership could give countries a major advantage in exploring advanced physics, energy production, and cybersecurity, as well as developing new materials, medications, and manufacturing processes that will leave other nations in the dust. Competition between nations, tribes, cities, and individuals seems to be baked into human experience and has resulted in stunning cultural advancesRead More

The PCI standard continues to evolve to meet the challenges of PCB design and offers the flexibility to play a role in future high-speed applications. By Florian Guglhör and Martin Adamczyk, ept connectors GmbH The PCI (Peripheral Component Interconnect) standard originated in the early 1990s as a bus protocol for chip-to-chip communication and the connectionRead More