Tele/Datacom Articles

AI Demands a Fresh Look at System Architecture

Engineers are rethinking system architecture to accommodate increasing data rates and performance demands. Emerging technologies like co-packaged optics and OSFP-XD pluggables promise higher bandwidth and improved efficiency. Unless you have spent the last two years living in a remote cave in the Himalayas, the emergence of artificial intelligence has likely caught your attention. There isRead More

New Connectivity Solutions for the AI Data Center

Advanced connectivity solutions are emerging to support new AI data center architectures. High-speed board-to-board connectors, next-generation cables, backplanes, and near-ASIC connector-to-cable solutions operating at speeds up to 224 Gb/s-PAM4 will accelerate the future of computing. By Wai Kiong Poon, Senior Global Product Manager for Mirror Mezz, Molex Artificial intelligence (AI) and machine learning (ML) applicationsRead More

A Standardized Approach to AI Safety and Innovation 

The U.S. Commerce Department has released its strategic vision for the U.S. Artificial Intelligence Safety Institute to advance AI with safety and responsible innovation. Hardware development is an important part of the conversation.  The rapid development and integration of artificial intelligence (AI) into various aspects of society necessitate the development of standards and guidelines toRead More

What are loopback cables?

What are loopback cables? Meet the Connector: Loopback Cables  A loopback cable is a diagnostic tool for testing the functionality of a physical port in networking systems. They are used to assess and resolve any issues with a network interface or network interface card (NIC) without linking to an external device. The loopback cable simulatesRead More

Optics Outpace Copper at OFC 2024

Bob Hult shares the phenomenal advances in high-speed optical communications showcased at OFC 2024, including interconnects for 200G per lane optical transmission, liquid cooling, co-packaged optics, PAM6, and other technologies that take us far beyond the reach of copper. The 2024 Optical Networking and Communication Conference and Exposition March 24-April 3 in San Diego nearlyRead More

Maintaining Connections in Compact Board-to-Board Applications

A system cannot sustainably operate if all components are constantly at maximum stress capacity. The ticket to longevity lies in designing a component system that can tolerate electrical fluctuations as well as physical movement of the hardware. Data centers, data storage, data display on screens – managing the amount of data and the many venuesRead More

State of the Industry: 2022-2023 Connector Sales

Bishop & Associates’ new report details global connector sales by region, market, and product category for 2022-2023, with insights into 2023 and beyond. In brief: Sales were down in 2022 — except where they were up. Bishop & Associates has been tracking the activities of the global connector industry for more than 40 years, includingRead More

Meet the Connector: DIN Standard Connectors

The German standards organization DIN is behind the quality, safety, and interoperability of electronic components used around the world. The term “DIN connector” refers to a wide range of connectors that adhere to standards set by the Deutsches Institut für Normung (DIN) or German Institute for Standardization. DIN standards for electronic connectors cover design, dimensions,Read More

Out Now! New eBook Shares Bright Ideas for Electrification

Industry experts share their latest innovations and connectivity solutions for this age of rapid technological advances. Download your copy here! As the list of connected and electrified aspects of our lives continues to grow, connector manufacturers and OEMs must consider sustainability, safety, efficiency, durability, performance, and value in new and inventive ways. BRIGHT IDEAS –Read More

Chip Technology Struggles to Keep Pace with Moore’s Law

The technical challenges of designing and building devices that pack tremendous computing power into tiny packages are considerable. But new high density semiconductor technologies offer a path to keeping Moore’s Law alive. For nearly 60 years, Moore’s Law has set the pace of advancements in semiconductor chip density, but a combination of physics and economicsRead More

NBASE-T and Integrated Connector Modules Speed Up Networks

The NBASE-T standard was devised to create lower-cost upgrade paths to boost network performance, achieve multigigabit speeds, while using CAT 5 and CAT 6 cabling already in place. There has always been an imperative to move data more rapidly, to simultaneously reduce the amount of time waiting for data and to handle the increasing amountRead More

2023 Connector Industry Acquisitions

Suppliers reached deeper into connected systems and adjacent technologies to expand capabilities with strategic acquisitions in 2023. Our annual acquisitions roundup tracks growth and changes at connector companies. The interconnect industry continues to become more interconnected as suppliers expand services, capabilities, products, and supply chains with strategic acquisitions. Several significant changes occurred in 2023 asRead More

eBook 2024 Bright Ideas
x