April 1, 2013—TE introduces an advanced modular cabling concept designed for speed and flexibility, facilitating data center migration from 1 to 100 Gb.

April 1, 2013–The development of the Mini-SAS HD active optical cable aligns with FCI’s high-speed IO value proposition.

April 1, 2013—CDFP MSA forming to develop standard transceiver specifications.

North American Headquarters Location: Lisle, IL, USA The Big Picture: “’We are continually innovating and investing in new products, technologies, and markets. Molex also works closely with customers across the globe to support their innovative design challenges.” About the Company Molex is a leading one-source supplier of interconnect products. Its team of highly skilled experts is focusedRead More

Avnet, Inc. is one of the largest distributors of electronic components, computer products and embedded technology serving customers in more than 70 countries worldwide.

March 19, 2013 – General manager of the company’s Secure Services and Information Assurance – US group will be a featured speaker. 

March 19, 2013 – Dr. Harvey awarded best paper by IWCS for defined progress in carbon nanotechnology in commercial applications.

March 19, 2013 – HARTING standard housings offer the user optimal protection against environmental influences.

March 14, 2013–Discussions and live demonstrations will take place at the API Technologies booth.

March 14, 2013–Advanced Interconnections demonstrates how easy the socket is to use for device and test validation.

March 12, 2013—Advanced sensor technology offers a powerful advantage for setup and changeovers.

March 12, 2013–Nine contestants, including victors from IPC hand-soldering competitions in India, China, and the United States, were challenged with building a functional electronics assembly within a one-hour time limit.