The new GradConn fine-pitch wire-to-board solutions offer, with .031″ and .039″ pitch, tiny PCB footprints and low-profile mounted heights. GradConn has released new fine-pitch wire-to-board range of solutions suitable for any application where space is at a premium, such as laptops, tablets, video cameras, and portable GPS systems. The new .031″ and .039″ pitch connectors offerRead More

FCI’s low-profile 1.2mm pitch wire-to-board connector expands and strengthens its compact connector portfolio. FCI introduced a low-profile, 1.2mm pitch wire-to-board connector. With a mated height of only 2.50mm, this new product line offers a selection of three to six pin counts, making them suitable for many applications. These additions will augment FCI’s existing catalog of compactRead More

At recent trade shows, interconnect suppliers spotlighted fiber optic innovations, as the connector industry forges ahead in optical technology. Just this month, Molex, TE, and US Conec all introduced new optical products that provide faster data rates, more versatility, and unlimited potential. Molex Technologies Support MXC Fiber Optic Interface Molex announced that its VersaBeam supports the new MXCRead More

Next-generation replacements for the Schleuniger CT Series Pneumatic Crimping Machines offer more power, flexibility, and productivity. For years, the Schleuniger CT Series Pneumatic Crimping Machines have proven an ideal solution for a large range of loose-piece crimping applications. Now Schleuniger has launched the next generation replacement machines with the introduction of the new CT series.Read More

The flexible silicone overmolding on Molex Affinity MediSpec cable assemblies protects the cable core from moisture ingress. The new Molex Affinity MediSpec silicone cable solutions will be showcased February 11-13, 2014, at the Molex booth (1746) at MD&M West in Anaheim, Calif. “We have extensive expertise in the design, development, and manufacturing of medical cables, connectors,Read More

Hendrix offers free recycling of HPI Insulators through a new mail-in program. Hendrix Molded Products introduces its Cradle-to-Cradle recycling program for the return and recycling of its HPI Polyethylene Insulator products constructed using #2 recyclable plastic. Familiar household products that are made from High Density Polyethylene (HDPE) are items such as milk, juice or waterRead More

ERNI’s Microspeed high-speed connectors support 25+Gb/s up to 5-20mm. Current measurements and simulations prove that ERNI’s MicroSpeed family of high-speed connectors, with corresponding design criteria and layout (-2dB insertion loss, 5mm board-to-board spacing), can support data rates of more than 25Gb/s. This in turn allows extremely fast board-to-board connections with distances of 5-20mm to beRead More

Compact-form-factor Molex zCD connector delivers data rates scalable up to 400Gb/s. Molex Incorporated has developed the compact zCD interconnect system to support next-generation applications in telecommunications, networking, and enterprise computing environments. The Molex zCD interconnect system will transmit 400Gb/s data rates (25 Gb/s over 16 lanes) with excellent signal integrity, electromagnetic interference (EMI) protection, andRead More

FCI Wins DesignVision Award for ExaMAX® Direct Mate Orthogonal Connectors Yesterday, FCI won a DesignCon DesignVision award in the interconnect technologies and components category for its ExaMAX® Direct Mate Orthogonal Connectors (DMO). The award program celebrates the achievements of the most innovative electronics companies and the unique tools that support customer needs to improve andRead More

Heilind Electronics Now Franchised for The Schaffner Group Heilind Electronics is now franchised for The Schaffner Group and offers a full array of Schaffner products. Schaffner’s products include EMC/EMI components, passive harmonic filters, and magnetic components. Schaffner components are deployed in energy-efficient drive systems and electronic motor controls, in wind power and photovoltaic systems, railRead More

Foxconn to Invest $40 Million in Pennsylvania Foxconn, the world’s leading manufacturer of computer components and systems, will invest $40 million in Pennsylvania, in the US, over two years, according to Group President Terry Guo. “The investment is in line with the US government’s “Advanced Manufacturing in America” policy,” said Guo. “Foxconn will invest $30Read More

Cellular M2M Device Shipments for Industrial Automation Reach 760,000 According to a new research report from the analyst firm Berg Insight, the shipments of cellular M2M devices in industrial automation reached 760,000 worldwide in 2013. Growing at a compound annual growth rate (CAGR) of 22.5%, shipments are expected to reach 2.1 million in 2018. TheRead More