Posts

Ethernet Networks Progress to 400 Gb/s

February 5, 2013 – Recently, the IEEE 802.3 Higher Speed Ethernet Consensus Ad Hoc group decided to focus its efforts on the next data rate of 400 Gb/s. The evolution of Ethernet technology hasbeen nothing short of remarkable: The next speed is in development before the current one has even reached the masses.

Socket To Me – The Selection and Use of High Performance Insulating Materials

February 5, 2013 -In many cases, materials that have stood the test of time simply will not work in today’s high-performance chipsets, and the designer must consider alternate materials for use in these powerful packages. Rich Orstad reviews some of these materials and provides guidance for proper selection and use in BGA, split chip, and test socket assemblies.

Big Future for Titanium Compounds in Electronics

January 22, 2013 – Titanium compounds perform an increasing variety of electronic functions, and their utility has proved far broader than silicon compounds. Dr. Peter Harrop examines current and future uses of the compound in next-generation applications and beyond. 

Structured Cabling Technology and Market Assessment

January 15, 2013 – The recession reduced investment, cancelled many projects, and impacted budgets in the structured cabling market. Meanwhile, changes in IT technology reshuffled the product mix end-users demand from manufacturers, forcing companies to reconsider their portfolios and adjust the way they approach the market.

Problem Solved: Opening Up Possibilities for the Robotics Industry

December 4, 2012 – When customers presented application challenges that weren’t met by traditional connector technology, TE Connectivity set out to develop a contactless technology that offered high performance with a low maintenance design. Here’s how TE solves problems faced by the robotics industry with its ARISO CONNECTLESS CONNECTIVITY.

Reducing Size and Weight of Connectors for Extreme Environments

November 13, 2012 – SEA CON has been working on many projects with the principle aim of reducing various key parameters, such as size and weight, of electrical and optical connectors for extreme environments, without major compromises on performance. This technology is not limited to underwater applications but also applies to those in tactical and support environments, including airborne, surface shipping, and field applications subject to extreme operating conditions. SEA CON’s Gary E. Brown discusses the drivers behind shrinking extreme environment connectors and the technology innovations that have resulted. You can read the complete white paper online.

Analysis of the World’s Top 100 Electronic Connector Manufacturers
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