As data speeds rise, the need for shielding can also increase. But shielding adds weight, cost, and can reduce flexibility, so it’s important to shield only when it’s necessary.   Determining When to Shield Aircraft Wiring A common question when it comes to designing an aircraft’s electrical wiring interconnect system (EWIS) is which of theRead More

FCI took the next step in the development of high-speed backplanes when it developed a cost-efficient way to deliver higher speed and density. While Teradyne and its partner Molex were increasing speed with successive generations of large, expensive, heavily shielded waferized connectors, FCI was listening to its large base of telecom, storage, and low-end computingRead More

Recent approval of the IEEE 802.3bp standard offers efficiencies for reducing the weight and cost of interconnections to support communication among an ever-growing roster of automotive subsystems. While advanced driver assistance systems (ADAS) and infotainment systems have been touted to automotive consumers for quite some time, automotive electronic engineers have been saddled with adapting olderRead More

The need to transmit more data at higher speeds is changing system design. New strategies include developing connectors specifically for high-speed operations, maintaining signal integrity at high speeds, and using new protocols. Today, interconnect technology has morphed to meet the need for speed.   The continuous growth in IP services and access speeds has ledRead More

The IEEE 200G/400G standard is well on its way to publication; so where will it be implemented?   This is the first time in the development cycle of Ethernet standards that there have been so many different standards projects in the pipeline. Ranging from EPON over Coax (EPoC) to 200Gb/s and 400Gb/s Ethernet, these effortsRead More

The physics associated with electronic signaling may point to the need for a more holistic system approach to higher performance.     At the beginning of the electronics era, the biggest challenge circuit engineers faced was designing low-resistance links between components. Very-early electronic systems often used discrete wire to make these connections, a process that wasRead More

40-gigabit applications over various media types are intended to reduce bottlenecks by providing improved speed within and between data centers.     The exponential growth of Internet and mobile device data traffic has had a huge impact on data center servers, high-performance computing clusters, and network storage equipment that serve and manage this traffic. 40-gigabit applicationsRead More

The Samtec SEARAY press-fit right-angle socket array provides increased design flexibility. Samtec’s family of SEARAY Open Pin Field Arrays has expanded to include a right-angle socket with press-fit terminations for increased design flexibility and high retention. This socket is a high-density solution for micro backplane applications with Samtec’s Edge Rate contact system optimized for signalRead More

Today’s requirements for input/output connectors demand smaller size and faster data transmission. Hirose advises designers on how to specify high-transmission I/O connectors by looking at a multitude of requirements and trade-offs.   An I/O connector is an interconnect that joins a circuit from inside to the outside of electronic equipment. I/O interconnects are used to connect data,Read More

Optical modules are key components in networking equipment, and specifying the right modules can heavily influence overall system performance. Here, Erin Byrne of TE offers tips on key considerations. Optical modules are key components in networking equipment, and specifying the right modules can heavily influence overall system performance. There are several issues to consider whenRead More

High-speed signal integrity concerns make choosing a connector for mezzanine board-to-board applications even more complex. Julian Ferry of Samtec offers advice on how to specify high-speed mezzanine connectors.   Choosing a connector for mezzanine board-to-board applications presents specification challenges in several engineering disciplines. High-speed signal integrity concerns make the selection even more complex. What is aRead More

As system speeds increase to multi-gigabit levels and beyond, ensuring signal integrity in high-speed channels requires major backplane connector performance upgrades.   Backplane architecture has served the electronics industry well for many years. Circuitry embedded in up to 40 layers of the backplane can create custom point-to-point, broad parallel bus structures or full mesh networks, essentiallyRead More