Starting a new FPGA project typically requires a custom form factor, pinout, and thermal concept for every design. Now the Standardization Group for Embedded Technologies (SGET)’s new Open Harmonized FPGA Module, or oHFM, puts a new high-speed board-to-board interconnect at the center of the design. A new standardized interface is changing the way FPGA applicationsRead More
Engineers frequently devote significant attention to processors, sensors, and software from the outset of a project, with connector selection sidelined until the later stages. However, the importance of electrical connectors cannot be underestimated: a single compromised connection can interrupt power delivery, corrupt data transmission, or bring equipment to a standstill. Article Contributed By Thisen BirdRead More
Power D or Combo D-subs are specialized mixed-layout connectors that combine standard signal contacts with larger contacts for power, coax (RF), or high voltage in one shielded, locking, D-shaped shell. Some product lines also add fiber-optic contacts. The two names are often used interchangeably; however, some manufacturers use “Power-D” and “Combo-D” to distinguish products inRead More
This week’s Product Roundup highlights connectors for lighting from leading connector manufacturers and suppliers. Connectors for lighting Lumberg’s RAST 2.5 connectors for direct mating with insulation displacement technology (IDT) are available with or without keying rib and closed sides for individual conductors. Daisy chain is possible. They are widely utilized in modern LED lighting, automotiveRead More
New-to-market connectivity products, including interconnects, wire, cable, and cable assemblies, sensors, antennas, materials, accessories, tools, and development kits. November 2026 New Connectivity Products November 2026 New Connectivity Products > Interconnects, etc. Samtec Inc. announced a new connector portfolio designed for the SGeT oHFM.c standard and based on Samtec’s proven AcceleRate® HD and AcceleRate® HP high-density, high-performance product families. oHFM™, or Open Harmonized FPGA Module, is the world’sRead More
The organization is now well-positioned to build momentum and accelerate the development, standardization, and global market adoption and implementation of Single Pair Ethernet (SPE) technology for industrial communication, automation, and IIoT. Single Pair Ethernet System Alliance and SPE Industrial Partner Network have merged to create the Single Pair Ethernet (SPE) Association, representing members from moreRead More
Engineers have been trying for years to massively reduce the lead content in copper-based alloys to comply with RoHS. Learn how a new lead-reduced Emery Low Lead alloy tested in various industrial fields of application and manufacturing processes. Article contributed by Dr. Andreas Frehn, Materion Brush GmbH, Germany, and Mike Gedeon and John Nickell, bothRead More
NDT cable is a shielded coaxial or multiconductor cable assembly that connects ultrasonic, eddy current, and phased array probes to non-destructive testing (NDT) instruments, carrying high-voltage excitation pulses to the probe and returning low-level echo or impedance signals to the receiver. It is built to stay flexible and electrically quiet through constant handling, scanner motion,Read More
This week’s Product Roundup highlights high-speed copper assemblies from leading connector manufacturers and suppliers. High-speed Copper Assemblies I-PEX CABLINE Series connectors enable high-performance harness assemblies by combining high-density packaging, high data-rate capability, excellent signal integrity, multiple pin-count options, and compact form factors for demanding high-speed applications. Selecting the optimal CABLINE harness requires balancing electrical parametersRead More
Bishop & Associates’ latest research report, Connector Industry Forecast 2025-2031F, offers a forecast for the connector industry’s performance from 2025 through 2031, along with a preliminary assessment of 2026. The connector industry is entering one of its strongest growth cycles in decades. With an anticipated 2025 growth of 12.5%, the strongest year-over-year growth since the 2021Read More
Dielectric multilayer ceramic capacitors are used in payload systems and satellite launchers, as well as for many internal cockpit displays. In 2015, AVX Corporation, now KYOCERA AVX, became the first company to be recognized as a qualified supplier of space-level base metal electrode (BME) X7R dielectric multilayer ceramic capacitors (MLCCs) for use in aerospace designsRead More
Aviation innovation has followed a predictable trajectory: incremental efficiency gains layered onto combustion-based propulsion. Now, electric and hybrid-electric aircraft are becoming central to aviation’s future. Article Contributed By Stuart Steadman, Senior Principal Engineer at TE Connectivity For more than a century, aviation innovation has followed a predictable trajectory: incremental efficiency gains layered onto combustion-based propulsion.Read More
