October 2013 – The Boston Common Garage and Zipcar announced the addition of four new 2014 Honda Accord Plug-in Hybrids to Zipcar’s Boston fleet, as well as plug-in stations and priority parking for Zipcars and other hybrid vehicles at the Boston Common Garage.
October 2013 – High data-rate, small form-factor pluggable optical transceivers (SFP+) answer the industry’s demand for increased bandwidth and higher port density. The higher performance and density of these devices creates challenges related to both excess heat and EMI emissions, but there are ways to address these concerns.
October 2013 – RADLOK provides low insertion and extraction forces with a high mating cycle rating.
October 2013 – ERNI introduces the industry’s first right-angle M12 version for automated processing.
October 2013 – Samtec expanded the Razor Beam line to include a new ultra-fine-pitch, low-profile system.
October 2013 – Many options are available for three- to 24-pole connectors, including termination by standard screw or tool-less spring.
October 2013 – In a follow-up to Dr. Bob’s article on connector wear in the last issue, his colleague Max Peel discusses the challenges of vibration in both connector and end-system designs. In the case of vibration testing, EIA requirements generally include a visual for structural integrity and monitoring for a 1.0 microsecond interruption. Occasionally low-level contact resistance or contact resistance at rated current measurements are included. This is the area for review, and change is necessary but somewhat complex.
October 2013 – In September, John MacWilliams took us through the process of researching, compiling, and writing the iNEMI Roadmap for the electronics industry and gave us a closer look at the findings in the connector section. In this issue, MacWilliams digs deeper into the forecasts for the test & burn-in socket market, highlighting the issues critical to the evolution of these products.
Molex Invests in Vasa Applied Technologies to Expand Medical Capabilities Molex has signed definitive agreements as a strategic partner and investor in Vasa Applied Technologies Ltd., based in Or Yehuda, Israel. Vasa is a start-up that has developed an innovative, patent-pending technology that allows accurate measurements of fluid flow rates and initial designs will beRead More
October 2013 – The four-way DEUTSCH industrial printed circuit board (PCB) features four 25-amp straight molded-in contacts.
October 2013 – Brian Crisp’s presentation will discuss probe technologies to improve first-pass yields.
October 2013 – The industry voted for the visionary CEO to headline next year’s expo.
