TE Connectivity Launches Fastest Interconnects for Communication Systems
October 2013—New TE zSFP+ interconnects boast 28 Gb/s transfer rates and adaptable upgradeability.
October 2013—New TE zSFP+ interconnects boast 28 Gb/s transfer rates and adaptable upgradeability.
October 2013 – TE Connectivity’s lightweight DUALOBE connector withstands -200ºC to +200ºC.
October 2013 – Samtec’s micro card socket is ideal for high-speed applications requiring board space savings.
October 2013 – Amphenol’s μCom-10Gb+ connector combines miniaturization and high-speed capacity with resistance to the harshest environments.
October 2013 – Fujitsu 0.8mm pitch stacking connector is designed to maintain a secure board-to-board connection in rugged industrial environments.
October 2013 – Torrel brings global electronics experience to Avnet’s Velocity Team, which provides tailored solutions for technology companies who want to more easily manage the complexity of their supply chains.
October 2013 – MSC Investoren acquisition strengthens Avnet’s leadership position in semiconductor distribution while expanding its presence in embedded computing and display solutions.
Internet of Things Gets Major Boost from IBM and Semtech IBM and Semtech Corporation, a leading supplier of analog and mixed-signal semiconductors, announced a significant advancement in wireless technology, combining IBM software and Semtech hardware to create a system capable of transmitting data up to a distance of 15km (9 miles), depending on the environment,Read More
Avnet Offers New Reference Designs and Tutorials for 7″ Zed Touch Display Kit Developing an interactive GUI or touchscreen application? Avnet Electronics Marketing announced new reference designs, tutorials, and training videos for the 7″ Zed Touch Display Kit. The designs are supported on either the MicroZed or Zedboard kits. To facilitate designs using the 7″Read More
Intel Unveils Quark-Based Galileo to Rival Raspberry Pi Intel has unveiled a low-cost single-board computer, called Galileo, aimed at the “maker” and education communities, in a move that can be seen as rivaling that of the popular Raspberry Pi device. Announced at the Maker Faire event in Rome by Intel chief Brian Krzanich, Galileo isRead More
October 2013—FDR25S power cable provides an optimal solution for tight spaces in mil/aero applications.
October 8, 2013—RF Industries provides outdoor and indoor multi-conductor composite power cables in standard and custom configurations.