Molex’s next-generation High-Density (HD) Active Optical Cables (AOC) transport 12Gb/s signals in lengths to 100 meters Molex continues to expand its iPass Connector and Cable Assembly Solution with the introduction of its High-Density Active Optical Cables (AOCs), capable of delivering 48Gb/s data rates over four lanes of 12Gb/s with reaches of up to 100 meters.Read More
Woodhead rugged assemblies provide EMI/RFI protection for high-powered switching and harsh-duty applications Molex Incorporated’s Woodhead MAX-LOC Plus Shielded Cord-Grip Assemblies feature a nickel-plated aluminum housing and shielding ring for superior electromagnetic interference (EMI) and radio frequency interference (RFI) protection. The assemblies enable Original Equipment Manufacturers (OEMs) and end-users to connect high-power electrical currents directly toRead More
Advanced Interconnections – Peel-A-Way® Removable Terminal Carriers – Video Hand loading of terminals slows down automated assembly processes. The solution: Peel-A-Way® Removable Terminal Carriers. Available in many standard and customized configurations. Ideal for socketing heat sensitive devices or board-to-board mating. Simply solder to the board and peel away the polyimide film for improved air flowRead More
Advanced Interconnections – Flip-Top™ BGA Test Sockets – Video Flip-Top™ BGA Test Sockets from Advanced Interconnections Corp. simplfy testing and validation of BGA and LGA devices, saving space on the board and speeding the test process. For complete product details, please visit www.advanced.com/products/bga-socketing-systems/flip-top-bga-test-sockets Advanced Interconnections Preferred Supplier Page
FCI at DesignCon: New I/O Cabling and High Density Connectors FCI will unveil three new connector solutions at this year’s DesignCon 2014. DesignCon is the world’s leading exhibition for electronics design engineers in the communications and semiconductor industries, and this is FCI’s 13th year participating in the expo. FCI will debut an I/O cabling solutionRead More
