The Schleuniger UniCrimp 100 bench crimping press can process wires up to 6mm2. Schleuniger’s new UniCrimp 100 delivers power and precision at a very competitive price. It is a simple and cost-effective crimping press that provides high-quality performance. With 20 kN (2.2 tons) of crimping force, the UniCrimp 100 can process wires up to 6mm2 (10AWG).Read More

The rapid growth of cloud computing requires data centers to scale up, but traditional copper presents limitations in distance, bandwidth, and efficiency.   The business of today’s data-driven world is being conducted in the Cloud. The rapid growth of cloud computing requires data centers to dramatically scale up in order to handle the oceans ofRead More

Fiber optics are poised to enable network functionality like never before with increased data rates and bandwidth inside the data center.   The need to change the data center network from a hierarchal one to a leaf-spine or more meshed one has arisen from the ever-increasing need for compute and storage access and the useRead More

Cloud computing and bandwidth-intensive applications have made the data center more important than ever, and managers want to squeeze every last bit of performance out of its architecture, even down to the connector level.   In today’s environment, data centers are gaining importance due to the trend of outsourcing access to data (through the Cloud) while continuously supporting bandwidth-intensive applicationsRead More

High-speed signal integrity concerns make choosing a connector for mezzanine board-to-board applications even more complex. Julian Ferry of Samtec offers advice on how to specify high-speed mezzanine connectors.   Choosing a connector for mezzanine board-to-board applications presents specification challenges in several engineering disciplines. High-speed signal integrity concerns make the selection even more complex. What is aRead More

Bishop & Associates completed its 2015 customer survey of electronic distributors. In the second of two articles, we reveal the distributors rated best for website usefulness and price competitiveness, as well as best overall distributor.   Bishop & Associates just concluded its annual survey of electronic distributors, in which it asked connector and cable assembly users toRead More

As system speeds increase to multi-gigabit levels and beyond, ensuring signal integrity in high-speed channels requires major backplane connector performance upgrades.   Backplane architecture has served the electronics industry well for many years. Circuitry embedded in up to 40 layers of the backplane can create custom point-to-point, broad parallel bus structures or full mesh networks, essentiallyRead More

The TE Fortis Zd LRM connector system is a modular backplane system that protects next-generation embedded computing. TE Connectivity announced its new Fortis Zd LRM connector system, an innovative modular connector system for rugged, next-generation packaging from avionics boxes to military ground vehicles. It features a rugged, lightweight multi-bay shell that accepts high-speed digital signal, power,Read More

The new JAE Electronics USB Type-C connector family offers all the features of the USB 3.1 specification as well as a friction lock, EMI reduction, and power delivery. JAE has debuted its full line of USB Type-C connectors. Based on the USB 3.1 specification that defines the next generation of USB connectors, the JAE DX07 offers allRead More

The Neoconix low-profile X-Beam electrical connectors are the ideal solution for mobile applications that require robust battery and signal connections. Neoconix announced immediate availability of its new X-Beam family of electrical connectors. Featuring an ultra-low-profile form factor and a simplified SMT assembly process, the X-Beam product family is the latest Neoconix offering specifically developed for mobileRead More

GradConn’s 1.20mm-pitch wire-to-board range is perfect for applications in which space is at a premium. GradConn’s new 1.20mm-pitch wire-to-board range offers a low-profile mated height of 1.45mm above the PCB. Its mating orientation makes it perfect for applications where space is at a premium. Available in two to six positions, horizontal PCB headers are polarized toRead More

Mergers, personnel changes, product news and more are all part of the news briefs for July 14, 2015. Amphenol has made a binding offer of $1.275 billion to Bain Capital for FCI Asia, which will be the company’s second acquisition this year. The acquisition, which will be financed with cash and debt, will close byRead More