The Molex MediSpec Plastic Circular System is an economical, custom-off-the-shelf interconnect system with a 10,000-cycle durability rating. Molex Incorporated introduced the MediSpec Medical Plastic Circular (MPC) Interconnect System, an economical custom-off-the-shelf interconnect system that delivers high mating cycles and low mating forces, at a fraction of the cost of competing machined-contact systems. Combining premium performanceRead More

ept’s flexilink press-fit board-to-board connectors utilize the Tcom press-fit system. ept introduced flexilinkb-t-b,a new board-to-board connector range based on the Tcom press-fit system. The connectors provide high-quality, non-pluggable connections between PCBs at a pitch of 2.54mm. The advantages are a reliable mechanical as well as electrical board-to-board connection created using just a single part. There is no need forRead More

The METZ CONNECT SC305/SL305 Terminal Blocks are compact and cost-effective, with spring-clamp, compression-mount contacts. METZ CONNECT introduced the new SC305 and SL305 series of terminal blocks with spring-clamp, compression-mount contacts. The terminal blocks facilitate a wire-to-board connection without the use of a header. Contact is established directly on the solder pads where a header would traditionallyRead More

The need for high-speed connections has expanded from office environments to remote and sometimes outdoor implementations, including those for the military. Here, ODU looks at the rugged high-speed data connector requirements to consider for such applications.   We’re all familiar with the types of connectors required to transfer high-speed data in our everyday lives, whether weRead More

The latest connector technology fuels growth in embedded computing as system efficiency is a critical component for today’s embedded industry.   Regardless of the modern mobile application in question, whether it be fleet management of agricultural machines, passenger information in buses or video surveillance of trains, the trend is clear – system efficiency is aRead More

TE recently announced the intent to form a new MSA to create a standard for a new pluggable form factor that will deliver four duplex channels at 25Gb/s NRZ per channel.   The race to ever-faster I/O interfaces continues to heat up. Design engineers are looking for ways to avoid a data bottleneck at the I/O panelRead More

Bishop & Associates researched industry trends, connector technology, and business forecasts to compile connector technology roadmaps through 2025.   Bishop & Associates recently released a report on connector technology roadmaps through 2025 with forecasts generated from industry input that examine trend line projections of US manufacturing data from a wide range of industries plus other industry data andRead More

Ed Bock of APEX Electrical Interconnection Consultants explains how to increase contact performance by pre-stressing to achieve greater strength and expanded dynamic range.   In examining the consequences of residual stress that develop in a contact beam subjected to stresses beyond the material’s elastic limit, we can see how residual stress may be beneficial, or if not properlyRead More

FCI’s Stephen Smith explains how to specify high-speed backplane connectors so your system will work now as serial data rates increase to beyond 25Gb/s, as well as into the future.    Despite the dire predictions of folks in the optical camp, armies of copper users continue to design systems that can transmit information at dataRead More

In December, the semiconductor market grew to a record $336 billion (up +10.0% YOY), while connector growth strengthened as well. The Semiconductor Industry Association (SIA) reported excellent growth in December 2014. December sales were a record $29.1 billion, up +9.3% from December 2013 and down -2.2% sequentially from November. 2014 semiconductor sales were up +10.0%Read More