Samtec Inc.

Interconnect News for January 15, 2016

Catch up on the latest interconnect promotions, launches, and events in interconnect news for January 15, 2016.   Molex Invests in Breakthrough Wireless Power Platform Ossia announced a strategic investment by Molex that will help expand market access to the groundbreaking Cota wireless power technology by facilitating the development of new consumer and B2B products. Cota’s game-changing wireless powerRead More

2015 Connector Product and Technology Trends in Review

2015 saw great leaps forward in technology, many of which were enabled by developments in connector design and manufacture.      At some point in the future, we may look back at 2015 and recognize it as a year when key technologies came together to enable a continuing series of next-generation products. Bishop & AssociatesRead More

Samtec SEARAY 0.80mm-Pitch Ultra High-Density Array Cable Assemblies

The Samtec SEARAY 0.80mm-pitch ultra high-density array cable assemblies provide performance up to 15 Gb/s with significant board space savings. Samtec’s SEARAY 0.80mm (.0315″) pitch ultra high-density array cable assemblies provide 50% board space savings compared to .050″ (1.27mm) pitch SEARAY systems. With performance to 15Gb/s and up to 300 total Edge Rate contacts, thisRead More

Samtec SEARAY Press-Fit Right-Angle Socket Array

The Samtec SEARAY press-fit right-angle socket array provides increased design flexibility. Samtec’s family of SEARAY Open Pin Field Arrays has expanded to include a right-angle socket with press-fit terminations for increased design flexibility and high retention. This socket is a high-density solution for micro backplane applications with Samtec’s Edge Rate contact system optimized for signalRead More

News Briefs for October 20, 2015

For the latest announcements from the connector industry, check out the news briefs for October 20, 2015. Molex expanded its printed electronics portfolio with the recent acquisition of Minnesota-based Soligie Inc. Custom Soligie solutions provide a robust and economical alternative to a rigid printed circuit board (PCB) or copper flex circuits in sensor applications forRead More

Samtec SkyRay Elevated Array System

The Samtec SkyRay elevated array system supports 28+Gb/s applicaations as well as PCIe and XAUI specifications. Samtec’s newly released SkyRay elevated array system offers design flexibility and high-speed performance without sacrificing signal integrity. The high-speed system supports 28+Gb/s applications, as well as PCIe and XAUI specifications. SkyRay is a three-piece system consisting of one riserRead More

Interconnect News for September 15, 2015

To learn more about the latest appointments, agreements, product achievements, and more, check out the interconnect news for September 15, 2015. Neoconix announced that Samtec has renewed its Neoconix PCBeam technology license agreement to continue their dual-source arrangement on the Samtec Z-Ray product line. This dual source arrangement allows Samtec to support new customers with anRead More

Facts & Figures: 2015 European Customer Survey Results

Bishop & Associates recently completed its annual survey of the connector industry’s European customers; in the first of two articles, we announce the top companies overall as well as those who scored high for product quality.   Bishop & Associates just completed an annual survey of the European connector industry, in which it asked customers aboutRead More

Embedded Optical Engines Find Their Niche

Demand for higher data rates, panel density, and practical channel lengths with acceptable signal integrity have put pressure on copper connectivity to deliver the most practical solution. Embedded optical transceiver technology emerges to address this need.   Copper circuits still rule the high-speed electronic world, but optical alternatives continue to chip away at that dominance in nicheRead More

How to Specify High-Speed Mezzanine Connectors

High-speed signal integrity concerns make choosing a connector for mezzanine board-to-board applications even more complex. Julian Ferry of Samtec offers advice on how to specify high-speed mezzanine connectors.   Choosing a connector for mezzanine board-to-board applications presents specification challenges in several engineering disciplines. High-speed signal integrity concerns make the selection even more complex. What is aRead More

News Briefs for June 9, 2015

The awards pile up along with acquisitions, partnerships, and promotions in the news briefs for June 9, 2015.   Molex Incorporated announced the acquisition of ProTek Medical Ltd. by Molex Ireland Holdings B.V. Headquartered in Sligo, Ireland, ProTek Medical Ltd. specializes in supplying custom solutions for medical device manufacturers in the global medical industry. ItRead More

Samtec Z-Ray Ultra-Low-Profile, Ultra-High-Density Interposers

Samtec Z-Ray ultra-low-profile, ultra-high-density interposers provide ultimate design flexibility. Samtec’s newly released Z-Ray one-piece arrays provide an ultra low profile and high density and are highly customizable. These compression-contact arrays are used as interposers or integrated into connector housings. Compared to standard interposers, they feature greater density, X-Y-Z axes flexibility, customizable shapes and patterns, increased cycle life, low normalRead More

Analysis of the World’s Top 100 Electronic Connector Manufacturers
x