GradConn Push-Push Micro SIM Connector

By News Release | November 17, 2014

The GradConn push-push Micro SIM connector offers functionality and cost-effective pricing.

GradConnGradCon Push-Push Micro SIM launched a brand new push-push Micro SIM connector, which delivers functionality and cost-effective pricing. Suitable for 3ff Micro SIM cards, the CH03-GB has a 1.50mm profile and measures just .620″ x .676″.

The CH03-GB is available with six or eight contacts and includes a card-detect switch feature which allows the user to detect when the card is inserted. It’s rated at 1,500 card-insertion cycles and has an operating temperature range of -40°C to +105°C.   The Micro SIM card is inserted directly, so no separate plastic tray is required.

Push-push-type SIM connectors allow a Micro SIM card to be pushed into place, then the second push triggers a spring that ejects the card; this function removes the need to extract tiny Micro SIM cards by hand. Push-push technology is normally used in applications where the end user insets a card from outside the equipment. The connector is mounted on the edge of a PCB with the mating face accessible via the customer’s panel design.

News Release
Get the Latest News