GradConn Push-Push Micro SIM Connector
The GradConn push-push Micro SIM connector offers functionality and cost-effective pricing.
GradConn
launched a brand new push-push Micro SIM connector, which delivers functionality and cost-effective pricing. Suitable for 3ff Micro SIM cards, the CH03-GB has a 1.50mm profile and measures just .620″ x .676″.
The CH03-GB is available with six or eight contacts and includes a card-detect switch feature which allows the user to detect when the card is inserted. It’s rated at 1,500 card-insertion cycles and has an operating temperature range of -40°C to +105°C. The Micro SIM card is inserted directly, so no separate plastic tray is required.
Push-push-type SIM connectors allow a Micro SIM card to be pushed into place, then the second push triggers a spring that ejects the card; this function removes the need to extract tiny Micro SIM cards by hand. Push-push technology is normally used in applications where the end user insets a card from outside the equipment. The connector is mounted on the edge of a PCB with the mating face accessible via the customer’s panel design.
- MikroElektronika Intel Joule click shields - May 10, 2017
- Right Angle Board-to-Board Battery Connectors Suit High Shock and Vibration Applications - May 10, 2017
- Compression Pulling Head Family Offers Six Sizes - May 3, 2017
