The technical challenges of designing and building devices that pack tremendous computing power into tiny packages are considerable. But new high density semiconductor technologies offer a path to keeping Moore’s Law alive. For nearly 60 years, Moore’s Law has set the pace of advancements in semiconductor chip density, but a combination of physics and economicsRead More

The OPC has grown into a collaborative community in which interconnect suppliers work with technology innovators to drive innovation and efficiency in data center infrastructure through open-source hardware.   The Open Compute Project (OCP) is an initiative that aims to design and share open-source hardware technologies, including interconnects, to help create more efficient data centers.Read More

Lessons learned in the high-stakes performance racing market transfer to the evolution of automotive and autonomous technologies. High-speed interconnects are key to these designs.   In the rapidly changing landscape of motorsports, Formula E has redefined the boundaries of racing by combining adrenaline-fueled competition with a commitment to sustainable innovation. Formula E also serves asRead More

In the years to come, it is projected that consumers worldwide will pivot from owning private cars, that they only use a fraction of the time to instead accessing mobility as a service (MaaS). With the breathless coverage of electric vehicles (EVs), it would be easy to believe that they represent a significant disruption toRead More

The reliable and easy-to-implement interface solution connects cells to the control board in an EV battery module, eliminating the need to daisy chain wires. Eight years ago, Molex took a leap and heavily invested in the equipment and capabilities to develop its cell contacting system in support of a market no one was sure wouldRead More

A new generation of wearable sensors are making cardiatrics, diabetes management, biometric monitoring, and medication delivery more comfortable and effective. Wireless health monitoring has been transformed by the possibilities afforded by miniaturized electronics. The first mass market of wearable medical devices took the form of fitness trackers and smartwatches embedded with biometrics sensors that monitorRead More

From tiny CubeSats to SpaceVPX satellites, the night sky is full of new constellations. Selecting components that can handle launch stressors, radiation, extreme temperatures, and other space challenges is essential to the mission. In the past three years alone, so many thousands of satellites have been launched into orbit that it’s difficult to gaze intoRead More

As outdoor agriculture becomes less predictable, vertical farms are bringing the farm inside, where sealed interconnects, sensor systems, smart LEDs, and connected technologies optimize every aspect of the growing cycle. The summer of 2023 brought extreme challenges to farmers around the world. Storms, droughts, wildfires, and record-breaking temperatures wiped out many crop yields. Up toRead More

As growing conditions become less stable and predictable, Agriculture 4.0 is coming indoors and boosting agricultural productivity through connected technologies. Vertical farming, also known as smart agriculture and Agriculture 4.0, uses technology to enhance crop production by automatically tracking critical parameters such as soil nutrition, temperature, and moisture levels for planting, fertilization, irrigation, and harvesting.Read More

The agriculture industry is looking to connected technologies to improve outcomes and ease the amount of effort required to produce food for a growing planet. The future of the agriculture industry is on the horizon — one where technology will be leveraged to provide greater control over nearly every aspect of the growing process andRead More

Advances in semiconductor functionality, density, and chip-level integration are generating new challenges in testing. A test socket solution overcomes the challenges posed by traditional vertical spring probes and cantilever scrubbing contact designs, providing a new level of performance and reliability. Integrated circuit (IC) designers are increasingly migrating to quad flat no-lead (QFN) packages to meetRead More

To meet the needs of high-frequency and high-performance applications as well as those with smaller, lighter, and more dense packaging, it is often necessary to modify existing connector designs or design completely new connectors. As RF/microwave technologies find increasing use in high-speed digital data exchange applications, the mix of connector and cable technologies included inRead More