Coaxicom Termination Improves Mechanical Integrity and Electrical Specs
February 12, 2013 – Coaxicom terminations are designed to minimize reflected power that impedes transmission quality.
Archives
L-com Receives Eight Finalist Nods from American Business Awards
February 7, 2013—This is L-com’s third outing to the finals in this award show.
FCI Cabled Solutions up to 40 Gb/s with ExaMAX Connector Technology
February 5, 2013–High-speed backplane connector technology provides a path for future designs.
Molex iPass+ zHD Vertical Connectors Operate at SAS-3 and Projected SAS-4 High-Speed Bandwidths
February 5, 2013—Low-profile connectors improve system airflow and signal integrity by eliminating midplane connections.
Yokowo Introduces First-Ever IPX7-Rated Waterproof Male Cradle Connector
February 5, 2013—Damaging liquid seepage into cradle connectors can now be prevented.
Consumer Electronics in Transition
February 5, 2013 – When the 2013 Consumer Electronics Show opened in Las Vegas last month, many were watching for the “next big thing,” not just from Apple but from many challengers. What does all this mean for the connector industry? John MacWilliams takes a closer look at the market’s opportunities.
Ethernet Networks Progress to 400 Gb/s
February 5, 2013 – Recently, the IEEE 802.3 Higher Speed Ethernet Consensus Ad Hoc group decided to focus its efforts on the next data rate of 400 Gb/s. The evolution of Ethernet technology hasbeen nothing short of remarkable: The next speed is in development before the current one has even reached the masses.
Video: Texas Instruments Demo with TE Connectivity STRADA Whisper Backplane Connector
February 5, 2013—At DesignCon, TI demonstrated its 25G/s advanced retimer technology with TE backplane connectors.
Samtec Announces Licensing Agreement with Hirose for IT3/IT5 Mezzanine Connector Systems
February 5, 2013—The IT5 High Speed Elevated Mezzanine connector handles 25+ Gb/s signal lines.
Molex Receives Delphi Pinnacle Awards for Supplier Excellence
February 5, 2013– Awards recognize Molex’s outstanding contributions to Delphi’s excellence culture.
Hirose Miniature Connectors Deliver Excellent Pick-and-Place Capability
February 5, 2013 – Hirose’s DF50 Series features a locking mechanism for secure mating.
Socket To Me – The Selection and Use of High Performance Insulating Materials
February 5, 2013 -In many cases, materials that have stood the test of time simply will not work in today’s high-performance chipsets, and the designer must consider alternate materials for use in these powerful packages. Rich Orstad reviews some of these materials and provides guidance for proper selection and use in BGA, split chip, and test socket assemblies.
