Archives

The FCI Minitek MicroSpace 1.27/1.5mm crimp-to-wire connector enables contact pitch compatibility with the LV214 Severity-2 standard. FCI announced the Minitek MicroSpace 1.27/1.5mm Crimp-to-Wire (CtW) connector, which enables contact pitch compatibility with the LV214 Severity-2 standard. Minitek MicroSpace 1.27/1.5mm connectors are ideal when high vibration endurance is required. The design features primary and secondary contact retention, Poka-yoke polarization, andRead More

The Schleuniger UniCrimp 100 bench crimping press can process wires up to 6mm2. Schleuniger’s new UniCrimp 100 delivers power and precision at a very competitive price. It is a simple and cost-effective crimping press that provides high-quality performance. With 20 kN (2.2 tons) of crimping force, the UniCrimp 100 can process wires up to 6mm2 (10AWG).Read More

The rapid growth of cloud computing requires data centers to scale up, but traditional copper presents limitations in distance, bandwidth, and efficiency.   The business of today’s data-driven world is being conducted in the Cloud. The rapid growth of cloud computing requires data centers to dramatically scale up in order to handle the oceans ofRead More

Fiber optics are poised to enable network functionality like never before with increased data rates and bandwidth inside the data center.   The need to change the data center network from a hierarchal one to a leaf-spine or more meshed one has arisen from the ever-increasing need for compute and storage access and the useRead More

Cloud computing and bandwidth-intensive applications have made the data center more important than ever, and managers want to squeeze every last bit of performance out of its architecture, even down to the connector level.   In today’s environment, data centers are gaining importance due to the trend of outsourcing access to data (through the Cloud) while continuously supporting bandwidth-intensive applicationsRead More

High-speed signal integrity concerns make choosing a connector for mezzanine board-to-board applications even more complex. Julian Ferry of Samtec offers advice on how to specify high-speed mezzanine connectors.   Choosing a connector for mezzanine board-to-board applications presents specification challenges in several engineering disciplines. High-speed signal integrity concerns make the selection even more complex. What is aRead More

Bishop & Associates completed its 2015 customer survey of electronic distributors. In the second of two articles, we reveal the distributors rated best for website usefulness and price competitiveness, as well as best overall distributor.   Bishop & Associates just concluded its annual survey of electronic distributors, in which it asked connector and cable assembly users toRead More

As system speeds increase to multi-gigabit levels and beyond, ensuring signal integrity in high-speed channels requires major backplane connector performance upgrades.   Backplane architecture has served the electronics industry well for many years. Circuitry embedded in up to 40 layers of the backplane can create custom point-to-point, broad parallel bus structures or full mesh networks, essentiallyRead More