Samtec Z-Ray Ultra-Low-Profile, Ultra-High-Density Interposers
Samtec Z-Ray ultra-low-profile, ultra-high-density interposers provide ultimate design flexibility.
Samtec’s newly released Z-Ray one-piece arrays provide an ultra low profile and high density and are highly customizable. These compression-contact arrays are used as interposers or integrated into connector housings. Compared to standard interposers, they feature greater density, X-Y-Z axes flexibility, customizable shapes and patterns, increased cycle life, low normal force with high deflection range, and 28+Gb/s performance.
These 0.80mm pitch arrays (ZA8 Series) are available with choice of dual-compression contacts or single compression with solder balls. With up to 400 total beryllium copper micro-formed contacts, they feature low 25g normal force with .008″ (0.20mm) contact deflection. Z-Ray is a one-piece design assembled into a rugged low-profile single-layer FR4 substrate under high pressure and temperature to achieve a 1.00mm stack height. Screw-down and alignment holes are standard for use with press-fit alignment hardware for a secure connection without over-compression between the PCB boards. A 34AWG twinax cable on 0.80mm pitch with eight and 16 pairs standard is in development.
A variety of custom capabilities are available including the overall shape of the interposer, multiple pitches as low as 0.65mm, greater density of up to 1,200 contacts per square inch in any pattern, and stack heights from 0.50mm to 4mm. Construction of the interposer is customizable with multi-layer FR4 – for example, pitch spreaders and other embedded interconnect circuitry. Design flexibility also includes features such as latches, thermal spreaders, and quick-release spring constraints for more rugged applications. Quick-turn customizations are available and require minimal NRE and tooling charges.