Traditional connector challenges are magnified as speeds increase, but new design tools, mezzanine approaches, and thermal management strategies help high-speed connector designs morph to meet challenging data demands. Jairo Guerrero, Director of Marketing, Enterprise Business Unit, Molex, LLC The continuous proliferation of IP services and access speeds has led to exponential growth in bandwidth andRead More

Get ready for hyperscale: To support the increased needs and speeds of data centers, components on all levels need to operate without fail in a high-speed environment. By Dave Helster, Director, System Architecture, TE Connectivity Data & Devices Data is the center of everything. Now, more than ever before, we rely on data each andRead More

The cabling system promises to streamline rack interconnect systems. Companies that design components for Ethernet systems will want to take a look at the RCx Multi-Source Agreement (MSA), a new intra-rack connection technology aimed at Ethernet applications. RCx MSA, an industry working group with members from Amphenol, Broadcom, Dell, Hewlett Packard Enterprise, and JAE Electronics,Read More

The cabling system promises to streamline rack interconnect systems. Companies that design components for Ethernet systems will want to take a look at the RCx Multi-Source Agreement (MSA), a new intra-rack connection technology aimed at Ethernet applications. RCx MSA, an industry working group with members from Amphenol, Broadcom, Dell, Hewlett Packard Enterprise, and JAE Electronics,Read More

Companies are working on new cable designs that will help move this promising technology beyond gaming and into the real world. Virtual reality (VR) is one of the fastest-growing segments of the electronics arena, with implications for the industrial, medical, consumer, automotive, and other markets. This is a young and quickly evolving segment, with potentialRead More

Synergy between advanced sensors as well as related connectors and cable assemblies is opening new avenues of growth and profit for the interconnect industry. Electronic sensors are popping up everywhere, and this technology is expected to proliferate logarithmically over the next few years. Sensors act as the eyes and ears of electronic equipment. They areRead More

As speeds and requirements rise, the QSFP-DD MSA comes forth as a solution that addresses the technical challenges of achieving a double-density interface. By Joe Dambach Next-Gen Datacenter Connectivity Chips, switches, connectors, cables, and optical module technologies are at the core of datacenter networks, which must be able to support increasingly faster processing, as wellRead More

Could Artificial Intelligence Spell Trouble for the Connector Industry? AI has the potential to change everything about how connectors are made — and who makes them. By Ray Alderman It’s time that we take a broad and pragmatic view of the future, what it holds for the electronics industry, and specifically what difficulties could beRead More

High-speed networks for military and commercial aircraft must handle ever-increasing data volumes at ever-faster speeds. Ethernet protocols, efficient network designs, and thoughtfully specified, high-quality connectors and cabling can help. Wes Morgan, Product Manager, ITT Cannon Addressing the Bandwidth Boom Modern military and commercial aircraft are technology-rich environments designed to deliver an increasingly sophisticated set ofRead More

Plug-in vehicles continue to grow in appeal and in power. 2018 promises to be the biggest year yet for the electric car. As automakers invest in electrified powertrains and charging infrastructure, opportunities continue to expand for connector suppliers. 2018 will bring new vehicles and new drivers to a continually innovating electric car landscape that isRead More

As the Internet of Things expands to link phones, appliances, security systems, and vehicles, manufacturers are looking to one SIM card that can talk to them all. By David Luu, Marketing Manager, GCT Connectors Embedded subscriber identity modules (eSIMs) or embedded universal integrated circuit cards (eUICCs) are integrated SIM chips that cannot be removed fromRead More

The two most widely used standards in the electronics industry, IPC-J-STD-001 and IPC-A-610, have been updated. How will this impact your work? IPC — Association Connecting Electronics Industries® has released the G revisions of IPC-J-STD-001, Requirements of Soldered Electrical and Electronic Assemblies, and IPC-A-610, Acceptability of Electronic Assemblies. These documents refer to the two most widelyRead More