Month: February 2013

Socket To Me – The Selection and Use of High Performance Insulating Materials

February 5, 2013 -In many cases, materials that have stood the test of time simply will not work in today’s high-performance chipsets, and the designer must consider alternate materials for use in these powerful packages. Rich Orstad reviews some of these materials and provides guidance for proper selection and use in BGA, split chip, and test socket assemblies.

Molex Introduces First-to-Market LED Array Plastic Interconnection Technology

Molex Introduces First-to-Market LED Array Plastic Interconnection Technology Molex introduced an LED array holder technology with integral electrical, mechanical, and optical connectivity for optimal performance and to simplify design integration for lighting manufacturers. Existing LED arrays represent a challenging compromise between the LED array metal printed circuit boards or ceramic substrates being small enough toRead More

Inside Connection: Schleuniger Inc

Company Name: Schleuniger Inc. North American Headquarters Location: Manchester, N.H. The Big Picture: “What transports, protects, amuses, cares, or provides for people almost always contains a little piece of Schleuniger technology.” About the Company Schleuniger (pronounced SHLOI-NI-GER) is one of the leading international manufacturers of high-precision cable processing machines. Whether cutting, stripping, crimping, sealing, or marking, Schleuniger’s automaticRead More

2026 World Connector Market Handbook 2025-2031F
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