The Denver Convention Center hosted SC23, this year’s edition of the Supercomputer conference, with the theme of i am hpc highlighting the depth and diversity of high-performance computing. The six-day event featured 90 research papers, 51 workshops, 37 tutorials, and 15 expert panels that explored the hardware, software, and emerging applications for this amazing technology.Read More

The hottest electric vehicles aren’t cars; an expanding world of personal transport options is changing the mobility landscape in cities around the world, thanks to the design possibilities afforded by powerful miniaturized interconnects. On an increasingly crowded planet, the ability to zip out of clogged traffic, park on congested streets, and lower transportation costs whileRead More

The reliable and easy-to-implement interface solution connects cells to the control board in an EV battery module, eliminating the need to daisy chain wires. Eight years ago, Molex took a leap and heavily invested in the equipment and capabilities to develop its cell contacting system in support of a market no one was sure wouldRead More

In April, automotive and component manufacturers, suppliers, and the media flocked to China to participate in Shanghai Auto Show, the world’s largest car show. This year’s theme was “Embracing the New Era of the Automotive Industry,” and the show did not disappoint. Manufacturers showcased 1,500 state-of-the-art vehicles across 12 exhibit halls. What may come somewhatRead More

A new generation of wearable sensors are making cardiatrics, diabetes management, biometric monitoring, and medication delivery more comfortable and effective. Wireless health monitoring has been transformed by the possibilities afforded by miniaturized electronics. The first mass market of wearable medical devices took the form of fitness trackers and smartwatches embedded with biometrics sensors that monitorRead More

From tiny CubeSats to SpaceVPX satellites, the night sky is full of new constellations. Selecting components that can handle launch stressors, radiation, extreme temperatures, and other space challenges is essential to the mission. In the past three years alone, so many thousands of satellites have been launched into orbit that it’s difficult to gaze intoRead More

As outdoor agriculture becomes less predictable, vertical farms are bringing the farm inside, where sealed interconnects, sensor systems, smart LEDs, and connected technologies optimize every aspect of the growing cycle. The summer of 2023 brought extreme challenges to farmers around the world. Storms, droughts, wildfires, and record-breaking temperatures wiped out many crop yields. Up toRead More

As growing conditions become less stable and predictable, Agriculture 4.0 is coming indoors and boosting agricultural productivity through connected technologies. Vertical farming, also known as smart agriculture and Agriculture 4.0, uses technology to enhance crop production by automatically tracking critical parameters such as soil nutrition, temperature, and moisture levels for planting, fertilization, irrigation, and harvesting.Read More

The agriculture industry is looking to connected technologies to improve outcomes and ease the amount of effort required to produce food for a growing planet. The future of the agriculture industry is on the horizon — one where technology will be leveraged to provide greater control over nearly every aspect of the growing process andRead More

As the data humans create and consume reaches once unimaginable volumes, a new nomenclature has been created to describe it. Carl Sagan, the eminent American astronomer, planetary scientist, cosmologist, astrophysicist, science communicator, author, and professor, invited people to imagine the huge number of stars in our galaxy. His famous quote, “billions upon billions of stars,”Read More

Advances in semiconductor functionality, density, and chip-level integration are generating new challenges in testing. A test socket solution overcomes the challenges posed by traditional vertical spring probes and cantilever scrubbing contact designs, providing a new level of performance and reliability. Integrated circuit (IC) designers are increasingly migrating to quad flat no-lead (QFN) packages to meetRead More

To meet the needs of high-frequency and high-performance applications as well as those with smaller, lighter, and more dense packaging, it is often necessary to modify existing connector designs or design completely new connectors. As RF/microwave technologies find increasing use in high-speed digital data exchange applications, the mix of connector and cable technologies included inRead More