By Bob Hult and John MacWilliams, Bishop & Associates   [hr] Advances in photonics, signal integrity, chip integration, and high-performance materials are enabling entirely new classes of electronic equipment. Bob Hult and John MacWilliams kick off the new year with a look at connector technologies to watch in 2015. The pace of change in theRead More

The debate continues but it is clear that by 2017, we will have a standard for 400G Ethernet. Lisa Huff does a reality check on Ethernet data rate progression over the next five years and the connector companies building prototypes for possible 400G solutions. Computer networks are on the cusp of a revolutionary change. Software-defined networking (SDN)Read More

With the increasing demand for a faster and more reliable form factor signal transmission interface, Yamaichi Electronics developed the eQSFP+ connector for 40/100GbE and Infiniband. With the increasing demand for a faster and more reliable form factor signal transmission interface, Yamaichi Electronics introduced its high-speed 32Gb/s enhanced Quad Small Form-factor Pluggable plus (eQSFP+) host connector, CN120-038-000*.Read More

Bob Hult reports on the connector technology highlights from DesignCon, especially the race to 100+Gb/s. The DesignCon 2014 conference and expo once again demonstrated the event’s value as the premier showcase for high-speed chip, connector, and PCB board technology. Featuring a full schedule of well-attended technical sessions over four days, a sense of excitement andRead More

Compact-form-factor Molex zCD connector delivers data rates scalable up to 400Gb/s. Molex Incorporated has developed the compact zCD interconnect system to support next-generation applications in telecommunications, networking, and enterprise computing environments. The Molex zCD interconnect system will transmit 400Gb/s data rates (25 Gb/s over 16 lanes) with excellent signal integrity, electromagnetic interference (EMI) protection, andRead More