Very early computers were a mass of discrete point-to-point wires. The combination of physics and economics is bringing that interconnect architecture back full circle. Design engineers have been grappling for years with the challenge of propagating ever-increasing signal rates in printed circuit boards. As data rates pushed into RF regions, signal modeling transitioned from simpleRead More

Check out this week’s product roundup for information about some of the industry’s latest and greatest optical transceiver products. Optical Transceivers Product Roundup Amphenol ICC’s 300Gb/s Leap® High-Speed Optical Transceiver Module is faster, smaller, and more efficient with regard to both cost and power than most conventional datacenter interconnects. It is capable of speeds up toRead More

Several trends were apparent at last week’s DesignCon 2017 conference. Foremost among them was the advance of copper solutions that include wiring as an alternative to PCB traces.   DesignCon 2017 opened amid a thoroughly drenched Bay Area, but did not deter more than 5,000 attendees to this premier exhibition of leading edge electronic design,Read More

The OFC show will mirror a dynamic and growing industry say organizers of this year’s event.      [quote]“With escalating bandwidth needs each year and the constant change in data rates from 10G to 40G to 100G, if you don’t attend even just one year of OFC, you are actually missing out. You are missingRead More

DesignCon 2016 featured 33 interconnect manufacturers, all concentrating on ever-higher speeds and improved signal integrity.   DesignCon 2016 opened in the shadow of preparations for Super Bowl 50 at Levi’s Stadium, directly across the street from the Santa Clara Convention Center. With more than 160 exhibitors and 4,800 pre-registered attendees, the exposition and conference continuesRead More

Given consumer demand for mobile products that offer more services in real time, designers need to take advantage of the most effective technologies available – wireless and photonic.   They say oil and water don’t mix, and for the most part that is true. To some degree, the challenges associated with mixing wireless connectivity andRead More

The DesignCon show floor opens today, so we spoke with some of the exhibitors to find out what they expect will be the hot technologies in this year’s Expo Hall.   Did you enjoy your workshops and survive your bootcamps? Well, slip on your walking shoes because the DesignCon show floor opens today, and there is so muchRead More

Demand for higher data rates, panel density, and practical channel lengths with acceptable signal integrity have put pressure on copper connectivity to deliver the most practical solution. Embedded optical transceiver technology emerges to address this need.   Copper circuits still rule the high-speed electronic world, but optical alternatives continue to chip away at that dominance in nicheRead More

At recent trade shows, interconnect suppliers spotlighted fiber optic innovations, as the connector industry forges ahead in optical technology. Just this month, Molex, TE, and US Conec all introduced new optical products that provide faster data rates, more versatility, and unlimited potential. Molex Technologies Support MXC Fiber Optic Interface Molex announced that its VersaBeam supports the new MXCRead More

The VITA specifications enable the embedded computer industry to support military, avionic, space, instrumentation, semiconductor processing, medical imaging, and industrial control applications. The way industry standards are often viewed by the engineering community has been the source of jokes for many years: How many engineers does it take to change a light bulb? None, they simplyRead More

DIN’s proliferation beyond the telecom world can be attributed to a few factors, most important of which is its adoption as part of the VMEBus standard, also known as Eurocard.